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High Purity Vanadium Sputtering Target, 99.9%
Product Type: Round planar sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This round planar sputtering target requires configuration review before use because batch-inspected parameters must match the agreed specification. Surface condition, dimensional tolerances, and bonding choice must be verified against the target sputtering system before installation.
- Surface condition verification: Verify the as-received surface finish satisfies the stated Ra limit before mounting.
- Dimensional tolerance verification: Confirm diameter and thickness tolerances are compatible with the cathode and shielding dimensions.
- Bonding configuration: Select the unbonded or copper-backed bonding option according to the chamber's cooling and mounting requirements.
- Controlled storage before installation: Keep the target in its vacuum packaging until installation to preserve the prepared surface.
- Batch documentation: Retain the certificate of analysis and confirm the batch-inspected parameters match the agreed configuration.
This procedure covers pre-installation configuration and compatibility review for the high-purity vanadium sputtering target. Confirmed model, accessories, and required configuration must be submitted with quotation requests.
- Confirm configuration
Confirm the model, working range, compatibility, consumables, and required configuration before quotation. - Review documentation
Review product specifications and configuration details against laboratory use requirements. - Match accessories
Match compatible accessories, replacement parts, and consumables according to the selected configuration. - Request quotation support
Include the required model, configuration, and quantity when requesting quotation support.
What purity and impurity limits can be expected from this 99.9% vanadium sputtering target?
The target is specified as 99.9% purity, V 3N material grade, with typical total critical impurities of <=1000 ppm. This makes it suitable for controlled sputtering workflows targeting hard coatings, wear-resistant coatings, and electronic devices where impurity carryover must be minimized.
What dimensional tolerances and bonding configurations must be checked before integrating this vanadium target into a sputter source?
The round planar target has typical dimensional tolerances of diameter +/-0.10 mm and thickness +/-0.10 mm. It ships unbonded, with optional Cu backing plate bonding available, so the sputter source geometry, clamping method, and bonding requirement should be confirmed before quotation to ensure compatibility.
How should the vanadium sputtering target be stored and handled prior to installation?
The target is vacuum packed with a certificate of analysis, and final parameters are confirmed by batch inspection and the agreed configuration. Because the surface state is specified as turned/ground with Ra<=1.6 um typical, keep it sealed in the vacuum packaging and avoid contacting or cleaning the sputtering surface until immediately before mounting.
The 99.9% pure vanadium round planar sputtering target is offered in unbonded form with optional Cu backing plate bonding, selectable thicknesses from 3 mm to 6.35 mm, diameters from 25.4 mm to 100 mm, and a turned/ground surface finish of Ra<=1.6 um typical.
Positive
- Controlled 99.9% purity with <=1000 ppm impurities: The V 3N grade and typical total critical impurity limit of <=1000 ppm support controlled sputtering workflows for hard coatings, wear-resistant coatings, and electronic device layers.
- Configurable target geometry and surface finish: Round planar geometry is offered in thicknesses from 3 mm to 6.35 mm and diameters from 25.4 mm to 100 mm, with a turned/ground surface at Ra<=1.6 um typical for application-fit selection.
Trade-offs
- Unbonded default; optional Cu backing plate bonding: The target is supplied unbonded unless Cu backing plate bonding is selected, so the buyer must confirm sputter source mounting and bonding requirements before ordering.
- Configuration must be confirmed before quotation: Thickness, diameter, surface condition, dimensional tolerance, and bonding options are finalized by batch inspection and the agreed configuration, so model compatibility and working range must be confirmed during procurement.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
