SPIN COATER AF-8PRO 10000 RPM PROGRAMMABLE THIN FILM DEPOSITION

RESEARCH GRADE EQUIPMENT

Product Overview

The AF-8pro series Spin Coater is a high-precision thin film deposition coating instrument purpose-built for research institutes, university laboratories, and small-to-medium batch production environments. Equipped with an advanced 10000 rpm programmable PLC control system and an intuitive 5-inch full-color touch screen interface, this programmable spin coater delivers stable and repeatable processing for substrates ranging from small fragments up to 8-inch standard circular wafers and various irregularly shaped substrates. The instrument supports an 8-inch wafer vacuum chuck configuration and is widely compatible with precision process requirements across semiconductor lithography, optoelectronic display fabrication, MEMS device manufacturing, and functional coating research, making it an ideal choice for laboratory thin film preparation and small-batch production.

Technical Specifications

PARAMETER	DETAILS
Model	AF-8pro
Chamber Design	Transparent Viewing Window Flip Lid with Concentric Dispensing Port
Control System	PLC Programmable Logic Controller
User Interface	5-Inch Full-Color Touch Screen
Substrate Size Range	Fragments to 8-Inch Round Substrates
Speed Range	20–10000 rpm
Vacuum Display	On-Screen Vacuum Level with Manual Pressure Adjustment Knob
Vacuum Chuck	Multiple Standard Size Vacuum Chucks Available
Power Supply	220 V / 50 Hz
Instrument Dimensions	650 × 470 × 320 mm (H)
Custom Configurations	Other model variants and vacuum chuck specifications are available upon request. Please contact us via email for custom orders.

Key Features & Advantages

Transparent Flip Lid with Concentric Dispensing Port: The upward-opening transparent viewing window allows real-time visual monitoring of the coating process, while the concentric dispensing port ensures uniform precursor solution delivery onto the substrate center for optimal film uniformity.
PLC Programmable Control with 5-Inch Touch Screen: The PLC-based control architecture combined with a full-color touch screen interface provides precise multi-step recipe programming, enabling reproducible spin speed ramps, dwell times, and acceleration profiles tailored to specific thin film deposition protocols.
Wide Substrate Compatibility from Fragments to 8-Inch Wafers: The AF-8pro processes substrates ranging from small irregular fragments up to 8-inch standard circular wafers and various irregularly shaped substrates, accommodating diverse research needs in semiconductor, optoelectronic, and MEMS applications.
Real-Time Vacuum Monitoring with Manual Adjustment: On-screen vacuum level display combined with a manual pressure adjustment knob provides precise substrate hold-down force control, preventing substrate warpage on delicate thin glass or flexible substrates.

APPLICATION SCOPE: Semiconductor photoresist spin coating for lithography processes. Organic light-emitting diode and perovskite thin film deposition for optoelectronic display research. MEMS sacrificial layer and structural polymer coating. Functional sol-gel and nanoparticle thin film coating for surface engineering. Polymer dielectric layer deposition for flexible electronics. Anti-reflection and protective hard coat application for optical components. Compatible with standard circular silicon, glass, quartz, and sapphire wafers as well as irregular-shaped substrates.

PACKAGING & DELIVERY: Each AF-8pro spin coater is securely packed in a reinforced instrument crate with custom foam inserts to protect precision mechanical and electronic components during transit. Standard accessories include one vacuum chuck for the specified substrate size, power cable, and user manual. Additional vacuum chuck sizes are available as optional accessories. Installation and operational training support are provided upon request.

IMPORTANT NOTICE: Always verify that the vacuum pump is connected and operational before loading substrates onto the chuck. Ensure the substrate is centered on the vacuum chuck and adequate vacuum hold-down pressure is achieved prior to initiating spin rotation. The maximum speed of 10000 rpm should only be used with appropriately sized substrates and well-balanced loading conditions. Clean the spin bowl and chuck surface after each use to prevent cross-contamination between coating materials. The instrument operates at 220 V / 50 Hz; verify local power supply compatibility before installation. For detailed operational and safety instructions, consult the user manual prior to first use.

TAILORED SOLUTIONS FOR RESEARCH

Contact our engineering team for technical support or official quotations.

EMAIL: inquiry@atomfair.com

Manufacturer: Atomfair LLC

Brand: ATOMFAIR®

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