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Aluminum-Nickel Alloy Sputtering Target (Al3Ni)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires operation within specified DC/RF power density and argon pressure ranges to achieve stoichiometric transfer and adhesion performance. Bonding type and backing plate must be selected for compatibility with the deposition system and thermal management requirements.
- Power Density Constraints: Operate the target at DC power densities of 3-15 W/cm² or RF power densities of 1-5 W/cm² to avoid overheating or insufficient sputter yield.
- Argon Atmosphere: Maintain an argon working pressure between 0.5 and 2.0 Pa during sputtering to sustain stable plasma and achieve uniform film deposition.
- Bonding Compatibility: Select indium bonding for high thermal conductivity or elastomer bonding for lower-temperature applications, ensuring compatibility with the target holder.
- Substrate Preparation: Prepare substrates to achieve adhesion strength greater than 15 MPa per ASTM D4541, requiring clean and properly activated surfaces.
- Thickness Uniformity: Expect ±5% thickness uniformity across a 100 mm substrate under optimized deposition parameters, verifying with profilometry or ellipsometry.
How does the 99.9% purity and sub-200 ppm oxygen+nitrogen level of the Al3Ni sputtering target impact film resistivity and adhesion in interconnect metallization?
The target's 99.9% purity with total metallic impurities <1000 ppm and combined O+N <200 ppm minimizes contamination, improving deposited film resistivity and adhesion. Under optimized sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) at 0.5-2.0 Pa Ar, films achieve adhesion >15 MPa per ASTM D4541 on properly prepared substrates.
What bonding and backing plate options are available for the Al3Ni target to ensure compatibility with standard magnetron sputter guns?
The target supports indium or elastomer bonding as optional choices, with backing plates available in oxygen-free copper or CuCrZr. These options allow users to match thermal conductivity and mechanical requirements of their specific sputtering system. The target's 2-inch diameter and 0.25-inch thickness are standard sizes for many sputter guns.
What are the recommended DC and RF magnetron sputtering parameters for achieving ±5% thickness uniformity across a 100 mm substrate with the Al3Ni target?
For DC sputtering, use 3-15 W/cm² power density; for RF, use 1-5 W/cm², both under 0.5-2.0 Pa Ar atmosphere. Under these conditions, deposition rates of 10-80 nm/min are achieved with ±5% thickness uniformity across a 100 mm substrate.
The Al3Ni sputtering target offers 99.9% purity with total metallic impurities below 1000 ppm and O+N below 200 ppm, enabling stoichiometric film deposition at rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates, suitable for interconnect metallization, diffusion barriers, and optical reflector coatings.
Positive
- High Purity and Controlled Impurities: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Optimized Deposition Performance: DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar yields 10-80 nm/min deposition rate with ±5% thickness uniformity on 100 mm substrates.
Trade-offs
- Bonding and Backing Plate Options Require Specification: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate are optional; must be selected based on deposition system compatibility and thermal management requirements.
- Sensitivity to Substrate Preparation: Adhesion strength >15 MPa (ASTM D4541 pull-off) requires properly prepared substrates; otherwise film adhesion may be compromised.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
