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Aluminum-Chromium-Copper Alloy Sputtering Target (AlCrCu)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires operation under controlled DC/RF power density and argon atmosphere within a vacuum deposition system. Bonding and backing plate selection must match the deposition system to ensure thermal management and film uniformity.
- Sputtering Parameters: Operate the target at DC power density 3-15 W/cm² or RF power density 1-5 W/cm² under an Ar atmosphere of 0.5-2.0 Pa to achieve deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
- Bonding and Backing: Bond the target using indium or elastomer bonding to an oxygen-free copper or CuCrZr backing plate to ensure thermal and electrical contact during sputtering.
- Surface Preparation: Maintain a machined surface finish with Ra ≤ 0.8 µm and relative density ≥95% of theoretical to minimize arcing and particle generation during deposition.
- Purity Control: Use the 99.99% purity target with total metallic impurities less than 100 ppm and oxygen plus nitrogen less than 20 ppm to minimize film contamination.
- Adhesion and Substrate: Ensure deposited films achieve adhesion strength greater than 15 MPa on properly prepared substrates per ASTM D4541 pull-off test.
How does the grain size of ≤50 µm in the AlCrCu target affect film uniformity and resistivity in DC magnetron sputtering applications?
The fine grain size (≤50 µm) ensures uniform erosion and consistent plasma behavior, contributing to thickness uniformity of ±5% across a 100 mm substrate at deposition rates of 10–80 nm/min under DC sputtering at 3–15 W/cm². This directly minimizes film resistivity variations for interconnect metallization and diffusion barrier layers.
What bonding and backing plate options are available for the AlCrCu sputtering target, and how do they affect thermal management in high-power RF sputtering?
The target offers optional indium bonding or elastomer bonding and backing plates of oxygen-free copper or CuCrZr. Indium bonding provides superior thermal conductivity for high-power DC sputtering up to 15 W/cm², while elastomer bonding is suitable for lower-power RF sputtering up to 5 W/cm². The choice impacts heat dissipation and target longevity under continuous deposition.
What surface finish and thickness tolerance are specified for the AlCrCu target, and why are these critical for vacuum sealing and repeatable deposition in a magnetron sputtering system?
The target has a machined surface finish of Ra ≤ 0.8 µm and thickness tolerance of ±0.1 mm. These specifications ensure proper vacuum sealing against the cathode and uniform target-to-substrate spacing, which are critical for maintaining consistent plasma impedance and deposition rate reproducibility across runs.
The AlCrCu sputtering target offers 99.99% purity and ≤50 µm grain size for low-contamination, uniform thin films, but requires careful control of sputtering parameters and bonding selection to achieve optimal performance.
Positive
- High purity with low impurities: 99.99% (4N) purity with total metallic impurities <100 ppm and O+N <20 ppm, minimizing contamination in deposited films and improving resistivity and adhesion.
- Fine grain size and high density: Grain size ≤50 µm and relative density ≥95% of theoretical enable uniform sputtering and dense film formation with reduced particulate generation.
Trade-offs
- Strict operating parameter window: Optimal stoichiometric transfer (±2 at%) and thickness uniformity (±5%) are achieved only within narrow DC/RF power density (3-15 W/cm² DC, 1-5 W/cm² RF) and Ar pressure (0.5-2.0 Pa) ranges; deviations may degrade film quality.
- Bonding and backing plate selection required: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate options must be matched to the deposition system's thermal and mechanical requirements; improper selection can cause thermal management issues during sputtering.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
