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Aluminum-Copper Alloy Sputtering Target (AlCu(95:5wt%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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DC/RF magnetron sputtering requires an argon atmosphere at 0.5-2.0 Pa with power densities of 3-15 W/cm² (DC) or 1-5 W/cm² (RF). Deposition rates of 10-80 nm/min and ±5% thickness uniformity over 100 mm substrates are achievable under optimized conditions.
- Atmosphere and Pressure: Sputtering must be conducted in an argon atmosphere maintained between 0.5 and 2.0 Pa for stable plasma operation.
- Power Density Limits: Apply power densities within 3-15 W/cm² for DC sputtering or 1-5 W/cm² for RF sputtering to avoid target damage and ensure stoichiometric transfer.
- Bonding and Backing Plate Compatibility: Select indium bonding or elastomer bonding with oxygen-free copper or CuCrZr backing plates compatible with the deposition system's thermal and mechanical requirements.
- Film Adhesion Requirement: Ensure substrate preparation achieves adhesion strength exceeding 15 MPa (ASTM D4541 pull-off) to prevent delamination of deposited AlCu films.
- Contamination Control: Maintain total metallic impurities below 100 ppm and oxygen plus nitrogen below 20 ppm to minimize film contamination and preserve resistivity.
What deposition rates and thickness uniformity can be achieved with the AlCu(95:5wt%) sputtering target under standard DC/RF conditions?
Under DC magnetron sputtering at 3-15 W/cm² or RF at 1-5 W/cm² in a 0.5-2.0 Pa Ar atmosphere, the target achieves deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
What bonding and backing plate options are available for the AlCu target to match different sputtering system requirements?
The target offers optional indium bonding or elastomer bonding, with backing plate choices of oxygen-free copper or CuCrZr. Indium bonding provides high thermal conductivity for power densities up to 15 W/cm², while elastomer bonding suits lower-temperature applications.
What purity and impurity specifications are critical for minimizing contamination in AlCu alloy sputtering?
The target is 99.99% (4N) pure with total metallic impurities below 100 ppm and O+N below 20 ppm. These strict limits minimize contamination, improving deposited film resistivity and adhesion as stated in the product specifications.
The AlCu(95:5wt%) sputtering target from Atomfair offers 99.99% purity with controlled impurities, fine grain size, and optimized sputtering parameters for uniform film deposition, but requires careful condition tuning and system compatibility verification.
Positive
- High purity with low impurities: 99.99% (4N) purity with total metallic impurities <100 ppm and O+N <20 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Optimized deposition parameters: Supports DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Condition-dependent stoichiometric transfer: Achieving stoichiometric transfer within ±2 at% requires optimized sputtering conditions, adding process development complexity.
- System compatibility verification required: Bonding type (indium or elastomer) and backing plate options (oxygen-free copper or CuCrZr) must be verified against deposition system constraints before ordering.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
