Niobium Round Sputtering Target 99.95% Nb 3N5 ATOMFAIR®

Price range: $115.00 through $280.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Nb 3N5 round planar sputtering target, 99.95% purity, 3–6.35 mm thick and 25.4–101.6 mm diameter, Ra≤1.6 μm typical. Order now.

SKU: AF-MT-S-NIOB-N35X-25IX
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High Purity Niobium Sputtering Target, 99.95%
Product Type: Round planar sputtering target
Research-grade laboratory product
Product Overview

High Purity Niobium Sputtering Target, 99.95% is a round planar sputtering target with 99.95% purity, 8.57 g/cm^3 density and 15.2 micro-ohm cm electrical resistivity for superconducting and electronic films, barrier layers, high-temperature films.

Available configurations cover thicknesses of 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm and diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm, 80 mm. The listed surface condition, dimensional tolerance and bonding options support configuration review before quotation.

Performance Features
  • 99.95% purity material grade for controlled sputtering workflows.
  • Round planar sputtering target geometry with the listed thickness and diameter options.
  • Surface preparation: Turning / grinding,Ra<=1.6 um (typical).
  • Typical use areas include superconducting and electronic films, barrier layers, high-temperature films.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-NB-99N95
Purity 99.95%
Material Grade Nb 3N5
Typical Total Critical Impurities Typical total critical impurities: <=500 ppm
Density 8.57 g/cm^3
Electrical Resistivity 15.2 micro-ohm cm
Surface State Turning / grinding,Ra<=1.6 um (typical)
Dimensional Tolerance Diameter+/-0.10 mm; thickness+/-0.10 mm (typical)
Target Type Round planar sputtering target
Bonding Unbonded; optionalCubacking plate bonding
Typical Applications superconducting and electronic films, barrier layers, high-temperature films
Packaging / Notes Vacuum packed with COA; final parameters are confirmed by batch inspection and the agreed configuration.
Available Thicknesses 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm
Available Diameters 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm, 80 mm
PROCUREMENT CHECK: Confirm model, working range, compatibility, consumables and required configuration before quotation.
DOCUMENTATION REVIEW: Product specifications and configuration details are reviewed against laboratory use requirements.
ACCESSORY MATCHING: Compatible accessories, replacement parts and consumables can be matched according to the selected configuration.
INQUIRY NOTE: Include the required model, configuration and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

The target surface finish must be maintained at Ra≤1.6 μm to ensure uniform sputtering. Storage in a dry, inert atmosphere is recommended to prevent oxidation of the niobium surface.

  • Surface Finish Constraint: The target surface is prepared by turning or grinding to a typical Ra≤1.6 μm, which must not be altered or damaged during handling.
  • Dimensional Tolerance Constraint: Diameter and thickness tolerances of ±0.10 mm must be verified against the sputtering system's target holder specifications.
  • Bonding Configuration Constraint: The unbonded or backing-plate-bonded configuration must be selected based on the sputtering system's cooling and mounting requirements.
  • Packaging and Storage Constraint: The target is vacuum packed with a certificate of analysis to minimize contamination and must be stored in a clean, dry environment until use.

What total critical impurity level is specified for the 99.95% niobium sputtering target, and why does it matter for film deposition?

The target is specified as 99.95% purity (Nb 3N5) with typical total critical impurities of <=500 ppm. This material grade is intended for controlled sputtering workflows, with a density of 8.57 g/cm^3 and electrical resistivity of 15.2 micro-ohm cm, supporting superconducting and electronic film, barrier layer, and high-temperature film applications.

Is this niobium sputtering target available unbonded or with a backing plate?

This target is supplied unbonded as standard, with optional Cu backing plate bonding available. The exact bonding configuration should be agreed before quotation; final parameters are confirmed by batch inspection and the agreed configuration.

What dimensional tolerance and surface finish are provided for mounting this target in existing sputtering systems?

Typical dimensional tolerances are diameter +/-0.10 mm and thickness +/-0.10 mm, with a turning/grinding surface finish of Ra <=1.6 um. Thickness and diameter options span 3–6.35 mm and 25.4–101.6 mm respectively, so the selected configuration should be checked against the sputter gun's mounting requirements.

This 99.95% niobium round planar sputtering target provides a controlled Nb 3N5 source with specified density, electrical resistivity, surface finish, and dimensional tolerances for superconducting, electronic, barrier, and high-temperature film deposition, though unbonded delivery and configuration-dependent final parameters require explicit confirmation before installation.

Positive

  • Controlled 99.95% purity Nb source: The Nb 3N5 grade with typical total critical impurities <=500 ppm supports reproducible sputtering behavior for superconducting and electronic films, barrier layers, and high-temperature films.
  • Precision-machined round planar geometry: Turning/grinding surface preparation with Ra<=1.6 um and +/-0.10 mm dimensional tolerances, combined with multiple diameter and thickness options, enables fit matching to specific deposition platforms.

Trade-offs

  • Unbonded target requires configuration check: The target is supplied unbonded, with Cu backing plate bonding optional, so buyers must specify and confirm mounting/bonding requirements before installation to avoid compatibility issues.
  • Final parameters depend on batch confirmation: Final parameters are confirmed by batch inspection and the agreed configuration, so model, working range, and platform compatibility must be verified before quotation and use.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Thickness

3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm

Diameter

25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm, 80 mm