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Aluminum-Manganese Alloy Sputtering Target (AlMn)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document outlines the critical processing constraints for the AlMn sputtering target. Adherence to these parameters is necessary to achieve the specified film properties and deposition performance.
- Power Density and Pressure Range: Operate DC sputtering at 3-15 W/cm² or RF sputtering at 1-5 W/cm² under an argon pressure of 0.5-2.0 Pa to achieve the stated deposition rates and uniformity.
- Bonding and Backing Plate Compatibility: Select indium bonding or elastomer bonding with an oxygen-free copper or CuCrZr backing plate to ensure thermal and electrical contact during deposition.
- Substrate Surface Preparation: Prepare substrates to achieve adhesion strength exceeding 15 MPa when measured by ASTM D4541 pull-off test.
- Surface Finish and Dimensional Tolerance: Ensure the target surface finish does not exceed Ra 0.8 µm and thickness tolerance remains within ±0.1 mm for consistent plasma ignition and film thickness.
What is the achievable deposition rate range and thickness uniformity for the AlMn sputtering target under DC magnetron sputtering?
Under DC magnetron sputtering at 3-15 W/cm² in 0.5-2.0 Pa Ar atmosphere, the target achieves deposition rates of 10-80 nm/min and thickness uniformity of ±5% across a 100 mm substrate.
What bonding and backing plate options are available for the AlMn sputtering target, and what are their power handling limits?
The target offers indium bonding or elastomer bonding, and backing plates of oxygen-free copper or CuCrZr. The target is rated for DC power densities up to 15 W/cm² and RF up to 5 W/cm², and the selected bonding and backing must be compatible with those power levels.
What are the purity specifications and how do they relate to film adhesion?
The AlMn target has 99.99% (4N) purity with total metallic impurities <100 ppm and O+N <20 ppm. Deposited films exhibit adhesion strength >15 MPa (ASTM D4541) on properly prepared substrates, and the low impurity levels help minimize contamination that could affect adhesion.
The AlMn sputtering target (99.99% purity, 2 in diameter) offers high purity and fine grain size for vacuum deposition, requiring optimized sputtering parameters (DC/RF, Ar pressure) and confirmation of bonding/backing plate compatibility with the user's system.
Positive
- High purity with low impurities: 99.99% (4N) purity with total metallic impurities <100 ppm and O+N <20 ppm reduces contamination risk, improving film resistivity and adhesion for critical thin-film applications.
- Optimized sputtering performance: Supports DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rate with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Requires optimized sputtering conditions: Stoichiometric transfer within ±2 at% is achieved only under optimized sputtering conditions; deviations in power density, pressure, or substrate preparation may affect film composition and performance.
- Bonding and backing plate selection needed: Bonding type (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) are optional; users must verify compatibility with their deposition system and thermal management requirements before ordering.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
