High Purity Nickel Sputtering Target 99.995%

Price range: $70.00 through $220.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Ni 4N5 round planar sputtering target with 99.995% purity, 8.91 g/cm3 density, Ra≤1.6 μm finish, and 25.4-101.6 mm diameters. Order now.

SKU: AF-MT-S-NICK-N45X-UM40
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High Purity Nickel Sputtering Target, 99.995%
Product Type: Round planar sputtering target
Research-grade laboratory product
Product Overview

High Purity Nickel Sputtering Target, 99.995% is a round planar sputtering target with 99.995% purity, 8.91 g/cm^3 density and 6.99 micro-ohm cm electrical resistivity for magnetic films, electronic devices, magnetron sputtering.

Available configurations cover thicknesses of 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm, 2 mm, 1.5 mm, 1 mm and diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm, 80 mm. The listed surface condition, dimensional tolerance and bonding options support configuration review before quotation.

Performance Features
  • 99.995% purity material grade for controlled sputtering workflows.
  • Round planar sputtering target geometry with the listed thickness and diameter options.
  • Surface preparation: Turning / grinding,Ra<=1.6 um (typical).
  • Typical use areas include magnetic films, electronic devices, magnetron sputtering.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-NI-99N995
Purity 99.995%
Material Grade Ni 4N5
Typical Total Critical Impurities Typical total critical impurities: <=50 ppm
Density 8.91 g/cm^3
Electrical Resistivity 6.99 micro-ohm cm
Surface State Turning / grinding,Ra<=1.6 um (typical)
Dimensional Tolerance Diameter+/-0.10 mm; thickness+/-0.10 mm (typical)
Target Type Round planar sputtering target
Bonding Unbonded; optionalCubacking plate bonding
Typical Applications magnetic films, electronic devices, magnetron sputtering
Packaging / Notes Vacuum packed with COA; final parameters are confirmed by batch inspection and the agreed configuration.
Available Thicknesses 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm, 2 mm, 1.5 mm, 1 mm
Available Diameters 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm, 80 mm
PROCUREMENT CHECK: Confirm model, working range, compatibility, consumables and required configuration before quotation.
DOCUMENTATION REVIEW: Product specifications and configuration details are reviewed against laboratory use requirements.
ACCESSORY MATCHING: Compatible accessories, replacement parts and consumables can be matched according to the selected configuration.
INQUIRY NOTE: Include the required model, configuration and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This document identifies the surface finish, dimensional tolerance, and bonding constraints that apply to the 99.995% nickel round planar sputtering target. Confirm these constraints before installing the target in a magnetron sputtering system.

  • Surface Finish Constraint: The target face is supplied with a turned or ground finish at a typical Ra no greater than 1.6 µm, so verify this surface condition before installation.
  • Dimensional Tolerance Constraint: The target diameter and thickness tolerances are each ±0.10 mm typical, so confirm that the delivered dimensions match the required configuration before mounting.
  • Bonding Configuration Constraint: The target is available unbonded or with optional copper backing plate bonding, so choose the bonding option that matches the sputtering cathode requirements.
  • Packaging and Traceability Constraint: The target is vacuum packed with a certificate of analysis, so retain the certificate with the lot documentation until the target is installed.

What is the dimensional tolerance of the 99.995% nickel sputtering target and how does it affect mounting compatibility?

The dimensional tolerance is diameter ±0.10 mm and thickness ±0.10 mm (typical). This tight tolerance ensures reliable fit into standard sputtering gun clamps or backing plates without requiring custom shimming, reducing the risk of arcing or uneven erosion during deposition.

What is the electrical resistivity of the 99.995% nickel target and why is it critical for magnetron sputtering?

The electrical resistivity is 6.99 micro-ohm cm. This low resistivity is essential for efficient DC magnetron sputtering, as it minimizes target heating and power loss, enabling stable plasma generation and consistent deposition rates for magnetic films and electronic devices.

Is the nickel sputtering target supplied bonded or unbonded, and what are the practical implications of each option?

The target is supplied unbonded as standard, with an optional copper backing plate bonding service. Unbonded targets allow direct mounting on existing cooled backing plates, while bonded targets provide improved thermal conduction for high-power sputtering, reducing the risk of target cracking or delamination.

This 99.995% Ni 4N5 round planar sputtering target is specified with 8.91 g/cm3 density, 6.99 micro-ohm cm resistivity, and typical Ra<=1.6 um surfaces; unbonded delivery and typical tolerances require configuration confirmation before quotation.

Positive

  • 4N5 Nickel Target with 99.995% Purity: Material grade Ni 4N5 with typical total critical impurities <=50 ppm supports controlled sputtering workflows for magnetic films and electronic devices.
  • Round Planar Geometry and Dimensional Tolerances: Available in diameters from 25.4 mm to 101.6 mm and thicknesses from 1 mm to 6.35 mm, with typical diameter and thickness tolerances of +/-0.10 mm and a typical turning/grinding surface finish of Ra<=1.6 um.

Trade-offs

  • Unbonded Default Requires Backplate Confirmation: The target is supplied unbonded unless optional Cu backing plate bonding is selected, so the buyer must confirm the bonding configuration before sputtering installation.
  • Typical Tolerances Need Batch and Configuration Approval: Dimensional, roughness, and impurity specifications are typical values confirmed by batch inspection and the agreed configuration, requiring pre-quotation review of the exact working range and compatibility.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Thickness

3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm, 2 mm, 1.5 mm, 1 mm

Diameter

25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm, 80 mm