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High Purity Molybdenum Sputtering Target, 99.99%
Product Type: Round planar sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What is the typical total critical impurity level for the Atomfair 99.99% molybdenum sputtering target, and how does it affect film quality in high-temperature applications?
The typical total critical impurities are ≤100 ppm, as specified for the Mo 3N5 grade material with 99.99% purity. This low impurity level minimizes contamination in sputtered films, which is critical for maintaining consistent electrical resistivity (5.30 micro-ohm cm) and structural integrity in high-temperature films, conductive layers, and barrier layers used in electronic devices.
What dimensional tolerances and surface finish are available for this molybdenum target, and how do they influence integration into standard sputtering systems?
The target offers diameter tolerance of ±0.10 mm and thickness tolerance of ±0.10 mm, with a typical surface finish of Ra ≤1.6 µm from turning or grinding. These tolerances ensure compatibility with standard round planar sputtering cathode assemblies, while the surface finish reduces arcing risk and promotes uniform erosion during deposition.
Does this molybdenum sputtering target come bonded to a backing plate, or is bonding required separately for thermal management?
The target is supplied unbonded by default, with optional copper backing plate bonding available upon request. Unbonded targets require the user to confirm bonding requirements for their specific sputtering system, as proper thermal contact is essential for heat dissipation during high-power or high-temperature deposition processes.
The AF-MO-99N99 round planar molybdenum target is specified at 99.99% purity (Mo 3N5) with typical total critical impurities <=100 ppm, 10.28 g/cm3 density, 5.30 micro-ohm cm resistivity, and +/-0.10 mm dimensional tolerances, making it applicable to high-temperature films, conductive layers, barrier layers, and electronic devices. It is unbonded by default, so Cu backing plate bonding or a compatible user-supplied mounting solution must be arranged before sputtering.
Positive
- 99.99% molybdenum with controlled impurities: Mo 3N5 grade at 99.99% purity and typical total critical impurities <=100 ppm supports controlled, reproducible sputtering for high-temperature and device-grade films.
- Low resistivity for conductive applications: The specified 5.30 micro-ohm cm electrical resistivity and 10.28 g/cm3 density are aligned with the listed target uses in high-temperature films, conductive layers, barrier layers, and electronic devices.
Trade-offs
- Unbonded by default: The target is supplied unbonded unless optional Cu backing plate bonding is selected, so users must specify bonding or provide a compatible backing/mounting solution for thermal management during sputtering.
- Verify final tolerance and surface: Diameter and thickness tolerances of +/-0.10 mm and Ra<=1.6 um surface finish are characterized as typical, with final parameters confirmed by batch inspection and the agreed configuration, requiring fit verification against the customer's cathode or target holder.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
