Manganese Round Sputtering Target 99.9% Mn 3N ATOMFAIR®

Price range: $95.00 through $215.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Mn 3N round planar sputtering target with 99.9% purity, 3–6.35 mm thickness and 25.4–101.6 mm diameter options; Ra≤1.6 μm. Vacuum packed with COA. Order now.

SKU: AF-MT-S-MANG-N30X-FZLX
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High Purity Manganese Sputtering Target, 99.9%
Product Type: Round planar sputtering target
Research-grade laboratory product
Product Overview

High Purity Manganese Sputtering Target, 99.9% is a round planar sputtering target with 99.9% purity, 7.21 g/cm^3 density and 144 micro-ohm cm electrical resistivity for magnetic/functional films, alloy films, magnetron sputtering.

Available configurations cover thicknesses of 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm and diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm. The listed surface condition, dimensional tolerance and bonding options support configuration review before quotation.

Performance Features
  • 99.9% purity material grade for controlled sputtering workflows.
  • Round planar sputtering target geometry with the listed thickness and diameter options.
  • Surface preparation: Turning / grinding,Ra<=1.6 um (typical).
  • Typical use areas include magnetic/functional films, alloy films, magnetron sputtering.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-MN-99N9
Purity 99.9%
Material Grade Mn 3N
Typical Total Critical Impurities Typical total critical impurities: <=1000 ppm
Density 7.21 g/cm^3
Electrical Resistivity 144 micro-ohm cm
Surface State Turning / grinding,Ra<=1.6 um (typical)
Dimensional Tolerance Diameter+/-0.10 mm; thickness+/-0.10 mm (typical)
Target Type Round planar sputtering target
Bonding Unbonded; optionalCubacking plate bonding/magnetic shim
Typical Applications magnetic/functional films, alloy films, magnetron sputtering
Packaging / Notes Vacuum packed with COA; final parameters are confirmed by batch inspection and the agreed configuration.
Available Thicknesses 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm
Available Diameters 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm
PROCUREMENT CHECK: Confirm model, working range, compatibility, consumables and required configuration before quotation.
DOCUMENTATION REVIEW: Product specifications and configuration details are reviewed against laboratory use requirements.
ACCESSORY MATCHING: Compatible accessories, replacement parts and consumables can be matched according to the selected configuration.
INQUIRY NOTE: Include the required model, configuration and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This document lists the stated technical constraints for the 99.9% manganese round planar sputtering target. These constraints apply to inspection, handling, configuration, and mounting decisions before deposition.

  • Surface condition constraint: The target face is supplied as turned or ground with a typical Ra of no more than 1.6 μm, so the surface must be protected from scratches and particulate contamination before use.
  • Dimensional tolerance constraint: Diameter and thickness each carry a typical tolerance of ±0.10 mm, requiring dimensional verification against the agreed configuration before mounting.
  • Bonding configuration constraint: The target is supplied unbonded unless Cu backing plate bonding or magnetic shim options are explicitly selected, so mounting compatibility must be confirmed before installation.
  • Packaging and verification constraint: The target is vacuum packed with a certificate of analysis, and final parameters are confirmed only by batch inspection and the agreed configuration.

What is the typical electrical resistivity of the 99.9% manganese sputtering target and how does it affect magnetron sputtering performance?

The target has an electrical resistivity of 144 micro-ohm cm. This relatively high resistivity compared to noble metals can influence plasma ignition and stability in DC magnetron sputtering; users may need to adjust power supply settings or consider RF sputtering for consistent deposition rates, especially at lower thicknesses.

What bonding options are available for this manganese target and when is backing plate bonding recommended?

The target is supplied unbonded by default, with optional copper backing plate bonding or magnetic shim available. Backing plate bonding is recommended for applications requiring efficient thermal management during high-power sputtering, while the magnetic shim option aids in magnetron compatibility for ferromagnetic manganese targets.

What are the dimensional tolerances and surface finish specifications for this manganese sputtering target?

The target has a typical dimensional tolerance of +/-0.10 mm for both diameter and thickness. The surface is prepared by turning or grinding to a typical roughness Ra <= 1.6 um. These tolerances ensure consistent fit in standard sputtering gun assemblies and uniform erosion profiles.

Engineering assessment of the 99.9% Mn round planar sputtering target confirms a 3N-grade manganese source with stated density, electrical resistivity, Ra≤1.6 µm turned/ground surfaces, and ±0.10 mm dimensional tolerances suited to magnetic/functional and alloy film magnetron sputtering. The unbonded standard configuration is a key integration constraint, as Cu backing plate bonding or magnetic shim options must be specified for magnetron use.

Positive

  • 3N purity with controlled impurities: The 99.9% Mn material grade lists typical total critical impurities at <=1000 ppm, providing a defined impurity envelope for controlled sputtering workflows in magnetic/functional and alloy film deposition.
  • Stated material properties for process design: Density is specified as 7.21 g/cm3 and electrical resistivity as 144 micro-ohm cm, giving measurable inputs for magnetron sputtering process calculations and platform compatibility reviews.

Trade-offs

  • Unbonded target requires backing plate option: The target is supplied unbonded, so Cu backing plate bonding or magnetic shim must be specified separately for magnetron sputtering integration, adding a mounting and thermal-management step.
  • Typical tolerances require batch confirmation: Surface roughness and dimensional tolerances are listed as typical, and final parameters depend on batch inspection and agreed configuration, so the user must qualify the delivered batch before acceptance.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Thickness

3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm

Diameter

25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm