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High Purity Hafnium Sputtering Target, 99.95%
Product Type: Round planar sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document defines handling constraints for the Atomfair high-purity hafnium sputtering target before and during installation. These constraints address surface preservation, dimensional verification, bonding configuration, and packaging integrity.
- Surface Integrity: Protect the prepared target surface from physical contact or contamination that could degrade the stated finish.
- Dimensional Verification: Verify the target diameter and thickness against the stated dimensional tolerance before installation.
- Bonding Configuration: Confirm whether the target is unbonded or bonded to a Cu backing plate, because unbonded targets require a compatible mounting method.
- Packaging Integrity: Maintain the vacuum packaging until immediately before installation to preserve surface condition.
- Documentation Review: Review the certificate of analysis and batch inspection records before acceptance to confirm purity and impurity limits.
This procedure prepares the hafnium sputtering target for ordering and installation verification. It covers configuration confirmation, specification review, inspection, and accessory matching.
- Confirm Configuration
Confirm the required model, working range, compatibility, consumables, and configuration before submitting a quotation request. - Review Specifications
Verify product specifications and configuration details against the laboratory use requirements. - Inspect Target
Inspect the target's diameter, thickness, and surface finish against the agreed configuration and stated tolerances before installation. - Match Accessories
Match compatible accessories, replacement parts, and consumables according to the selected configuration. - Submit Inquiry Details
Include the required model, configuration, and quantity when requesting quotation support.
What is the typical dimensional tolerance for the 99.95% hafnium sputtering target, and how does it affect sputtering uniformity?
The target has a diameter tolerance of +/-0.10 mm and a thickness tolerance of +/-0.10 mm (typical). This tight tolerance ensures consistent target-to-substrate spacing and uniform erosion across the target surface, which is critical for maintaining reproducible film thickness in high-k dielectric and barrier layer deposition processes.
Can this hafnium target be bonded to a copper backing plate for use in high-power magnetron sputtering systems?
Yes, the target is available unbonded by default, but optional copper backing plate bonding is offered. This bonding option is essential for high-power sputtering applications where efficient heat dissipation is required to prevent target cracking or delamination, particularly when depositing high-temperature materials or thick films.
What surface finish and packaging are provided to ensure the hafnium target is ready for immediate use in a cleanroom environment?
The target surface is prepared by turning or grinding to a typical roughness Ra <= 1.6 µm, which minimizes particle generation during pre-sputtering. It is vacuum packed with a Certificate of Analysis (COA) to prevent oxidation and contamination, ensuring the 99.95% purity and 33.5 micro-ohm cm resistivity are preserved upon receipt.
This round planar hafnium sputtering target is specified at 99.95% purity with 13.31 g/cm³ density and 33.5 µΩ·cm electrical resistivity, making it appropriate for high-k dielectric/barrier layer, high-temperature material, and electronic device deposition work. The available thickness and diameter options plus optional Cu backing plate bonding allow configuration matching, though the unbonded default and batch-confirmed final parameters require explicit procurement confirmation.
Positive
- Controlled 99.95% hafnium purity: Hf 3N5 grade with typical total critical impurities ≤500 ppm supports reproducible sputtering conditions for high-k dielectric/barrier layer and electronic device processes.
- Broad geometry and bonding options: Multiple thicknesses from 3 mm to 6.35 mm and diameters from 25.4 mm to 101.6 mm, with optional Cu backing plate bonding, allow matching to different sputtering chamber configurations and thermal management needs.
Trade-offs
- Unbonded standard configuration: The target ships unbonded by default; laboratories whose sputter sources require a bonded target must specifically select the optional Cu backing plate bonding or arrange separate mounting provisions.
- Batch-confirmed final specifications: Surface state, dimensional tolerance, and final parameters are described as typical and are confirmed by batch inspection plus the agreed configuration, so each procurement lot should be verified against process requirements.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
