|
High Purity Copper Sputtering Target, 99.9999%
Product Type: Round planar sputtering target
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||||||
|
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
|
This round planar sputtering target is supplied unbonded and vacuum packed with a certificate of analysis. The sputtering surface must remain protected from contamination and mechanical damage before installation.
- Surface protection: Protect the sputtering surface from contact and contamination until the target is installed.
- Vacuum packaging storage: Store the target in its sealed vacuum packaging until immediately before installation to preserve the certified surface condition.
- Bonding configuration: Confirm whether backing plate bonding or magnetic shim mounting is required before installation because the target is supplied unbonded.
- Dimensional verification: Verify the diameter and thickness tolerances against the cathode clamping interface before mounting the target.
The following procedure covers target inspection, mounting, and installation for a round planar sputtering target. Perform these steps in a clean area to avoid contaminating the sputtering surface.
Required Equipment: Backing plate, Magnetic shim
- Verify certificate and dimensions
Verify the certificate of analysis and the ordered diameter and thickness before opening the vacuum packaging. - Inspect sputtering surface
Open the vacuum packaging in a clean area and inspect the sputtering surface for visible contamination or damage. - Mount target
Mount the target on the selected backing plate or magnetic shim if that mounting option was selected in the confirmed configuration. - Install into cathode
Install the assembled target into the sputtering cathode and confirm that the clamping surfaces match the dimensional tolerance.
What does the 99.9999% purity grade of the AF-CU-99N9999 copper sputtering target mean for deposition performance?
The 99.9999% (6N) purity grade limits typical total critical impurities to <=1 ppm, which supports controlled sputtering of conductive films and interconnect layers without significant contamination. The stated density of 8.96 g/cm^3 and electrical resistivity of 1.68 micro-ohm cm are the accompanying material parameters relevant to film conductivity and process stability.
Which thickness and diameter configurations are available for this round planar copper sputtering target, and what tolerances should be checked for fit?
The target is offered in thicknesses of 3 mm, 4 mm, 5 mm, 6 mm, and 6.35 mm, with diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, and 100 mm. Typical dimensional tolerance is +/-0.10 mm on both diameter and thickness, so the final fit should be confirmed against the selected configuration before quotation.
Does the AF-CU-99N9999 sputtering target arrive bonded or unbonded, and what configuration options affect installation?
The target is supplied unbonded as standard, with optional Cu backing plate bonding or magnetic shim available for compatibility with magnetron sputtering systems. It is vacuum packed and ships with a COA; final parameters are confirmed by batch inspection and the agreed configuration.
This 99.9999% Cu round planar sputtering target provides a 6N-grade material with 8.96 g/cm³ density and 1.68 μΩ·cm electrical resistivity, available in 25.4–101.6 mm diameters and 3–6.35 mm thicknesses for magnetron sputtering of conductive films and interconnect layers.
Positive
- 6N purity with ≤1 ppm critical impurities: The 99.9999% Cu grade with typical total critical impurities ≤1 ppm supports controlled sputtering workflows for conductive films and interconnect layers with minimized foreign-element contribution.
- Tight dimensional tolerances and surface finish: Diameter and thickness tolerances of ±0.10 mm typical, combined with a turned/ground surface at Ra≤1.6 μm typical, provide consistent geometric and surface conditions for magnetron sputtering mounting.
Trade-offs
- Unbonded standard requires mounting decision: The target is supplied unbonded; Cu backing plate bonding or magnetic shim is optional and must be specified, otherwise the user must provide separate cathode mounting provisions.
- Typical values require batch confirmation: Surface finish and dimensional tolerance are stated as typical, and final parameters are confirmed by batch inspection and the agreed configuration, so the working range and configuration should be verified before quotation.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
