Round Cobalt Sputtering Target 99.95% Co 3N5 ATOMFAIR®

Price range: $70.00 through $245.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Co 3N5 round planar cobalt sputtering target with 99.95% purity, 8.90 g/cm3 density, Ra≤1.6 μm surface, and 1-6.35 mm thickness options. Order now.

SKU: AF-MT-S-COBT-N35X-261J
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High Purity Cobalt Sputtering Target, 99.95%
Product Type: Round planar sputtering target
Research-grade laboratory product
Product Overview

High Purity Cobalt Sputtering Target, 99.95% is a round planar sputtering target with 99.95% purity, 8.90 g/cm^3 density and 6.24 micro-ohm cm electrical resistivity for magnetic films, magnetron sputtering, electronic devices.

Available configurations cover thicknesses of 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm, 2 mm, 1 mm and diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm. The listed surface condition, dimensional tolerance and bonding options support configuration review before quotation.

Performance Features
  • 99.95% purity material grade for controlled sputtering workflows.
  • Round planar sputtering target geometry with the listed thickness and diameter options.
  • Surface preparation: Turning / grinding,Ra<=1.6 um (typical).
  • Typical use areas include magnetic films, magnetron sputtering, electronic devices.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-CO-99N95
Purity 99.95%
Material Grade Co 3N5
Typical Total Critical Impurities Typical total critical impurities: <=500 ppm
Density 8.90 g/cm^3
Electrical Resistivity 6.24 micro-ohm cm
Surface State Turning / grinding,Ra<=1.6 um (typical)
Dimensional Tolerance Diameter+/-0.10 mm; thickness+/-0.10 mm (typical)
Target Type Round planar sputtering target
Bonding Unbonded; optionalCubacking plate bonding
Typical Applications magnetic films, magnetron sputtering, electronic devices
Packaging / Notes Vacuum packed with COA; final parameters are confirmed by batch inspection and the agreed configuration.
Available Thicknesses 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm, 2 mm, 1 mm
Available Diameters 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm
PROCUREMENT CHECK: Confirm model, working range, compatibility, consumables and required configuration before quotation.
DOCUMENTATION REVIEW: Product specifications and configuration details are reviewed against laboratory use requirements.
ACCESSORY MATCHING: Compatible accessories, replacement parts and consumables can be matched according to the selected configuration.
INQUIRY NOTE: Include the required model, configuration and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This document records the technical constraints for the Atomfair 99.95% cobalt round planar sputtering target. These constraints apply to the selected thickness and diameter variation after procurement confirmation.

  • Dimensional compatibility check: Confirm the selected target diameter and thickness against the receiving chamber and sputtering source dimensions before installation.
  • Backing plate mounting decision: Select either an unbonded target or the optional copper backing plate bonding based on the mounting requirements of the deposition system.
  • Surface preservation during storage: Maintain the target in vacuum packaging until loading into the deposition chamber to preserve the prepared surface condition.
  • Incoming surface verification: Inspect the target surface state and dimensional tolerances during receiving to confirm conformance with the agreed configuration.

How does the 99.95% purity and 6.24 µΩ·cm electrical resistivity of the cobalt sputtering target affect film quality in magnetron sputtering for magnetic applications?

The 99.95% purity (Co 3N5 grade) with total critical impurities ≤500 ppm ensures minimal contamination in deposited magnetic films. The electrical resistivity of 6.24 µΩ·cm is suitable for stable magnetron sputtering discharge, aiding consistent deposition rates for electronic device and magnetic film applications.

What bonding and dimensional tolerance options are available for integrating this cobalt sputtering target into a standard magnetron sputtering system?

The target is supplied unbonded with optional Cu backing plate bonding. Dimensional tolerance is ±0.10 mm for diameter and thickness (typical), and available diameters range from 25.4 mm to 101.6 mm with thicknesses from 1 mm to 6.35 mm. Surface finish is Ra ≤1.6 µm via turning/grinding, supporting compatibility with standard round planar sputtering cathode assemblies.

What packaging and handling precautions are required for the 99.95% cobalt sputtering target to maintain purity before installation?

Each target is vacuum packed with a Certificate of Analysis (COA) to prevent oxidation and contamination. Final parameters are confirmed by batch inspection, and the target should be stored in a clean, dry environment. Bonding and handling instructions should be reviewed with the agreed configuration to maintain surface integrity.

This 99.95% pure round planar cobalt sputtering target provides Co 3N5 grade material at 8.90 g/cm3 density and 6.24 micro-ohm cm resistivity, with thickness options from 1 mm to 6.35 mm and diameters from 25.4 mm to 101.6 mm for magnetic film, magnetron sputtering, and electronic device applications.

Positive

  • Controlled-purity cobalt sputtering source: The 99.95% purity Co 3N5 grade with <=500 ppm typical total critical impurities supports reproducible deposition for magnetic film, magnetron sputtering, and electronic device workflows.
  • Configurable planar target geometry: Multiple thickness and diameter configurations, combined with a turning/grinding surface finish of Ra<=1.6 um typical, allow users to match the target to their magnetron sputtering platform and process requirements.

Trade-offs

  • Unbonded delivery requires bonding specification: The target is supplied unbonded unless optional copper backing plate bonding is requested, so users must confirm the backing plate assembly and system compatibility before ordering.
  • Typical tolerances require batch confirmation: Dimensional tolerance and surface finish are stated as typical values, with final parameters confirmed by batch inspection; critical dimensions and finish requirements must be agreed per configuration.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Thickness

3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm, 2 mm, 1 mm

Diameter

25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm