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Aluminum-Molybdenum Alloy Sputtering Target (AlMo)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document defines the operational constraints for the AlMo sputtering target in vacuum deposition workflows. The target must be used only under conditions that preserve target integrity, film purity, and substrate adhesion.
- Specification verification: Confirm the selected composition, dimensions, substrate system and quantity for the intended coating process.
- Mounting compatibility: Select the bonding type and backing-plate material that match the deposition system's target mounting configuration.
- Sputtering atmosphere: Maintain an argon process atmosphere within the specified pressure range during magnetron sputtering.
- Power application: Apply DC or RF power within the rated power-density range for the selected sputtering mode.
- Substrate preparation: Use properly prepared substrates to achieve the stated pull-off adhesion strength after deposition.
This procedure covers the preparation and operation of the AlMo sputtering target in a DC/RF magnetron sputtering system. The target is processed under argon atmosphere in a vacuum coating chamber.
Required Equipment: DC/RF magnetron sputtering system
- Confirm target configuration
Confirm the target composition, dimensions, purity grade, and bonding requirements against the deposition system. - Prepare substrates
Prepare the substrate surfaces properly before initiating deposition. - Set process atmosphere
Set the sputtering chamber to the specified argon pressure range before applying power. - Apply sputtering power
Apply DC or RF power within the rated power-density range for the selected sputtering mode.
What is the maximum power density and deposition rate for the AlMo sputtering target under DC and RF magnetron sputtering?
The AlMo target is optimized for DC magnetron sputtering at 3–15 W/cm² and RF magnetron sputtering at 1–5 W/cm², both under a 0.5–2.0 Pa Ar atmosphere. Under these conditions, deposition rates of 10–80 nm/min are achievable with ±5% thickness uniformity across a 100 mm substrate.
What are the bonding and backing plate options for this AlMo target, and how do they affect integration with a sputtering system?
The target offers indium bonding or elastomer bonding as optional bonding types, with backing plate options of oxygen-free copper or CuCrZr. These choices must be confirmed against the deposition system's cooling and mounting requirements before ordering, as they directly impact thermal management and mechanical compatibility.
What are the purity and impurity limits of the AlMo sputtering target, and how do they influence film quality?
The target has a purity of 99.9% (3N) with total metallic impurities below 1000 ppm and oxygen plus nitrogen below 200 ppm. This high purity minimizes contamination during deposition, improving deposited film resistivity and adhesion, with adhesion strength exceeding 15 MPa per ASTM D4541 on properly prepared substrates.
The AlMo sputtering target provides 99.9% purity with a fine-grained microstructure and specified sputtering parameters for uniform film deposition, but requires careful matching of bonding and backing plate options to the user's deposition system.
Positive
- High purity with low impurities: 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Optimized sputtering performance: DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar yields deposition rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Specification matching required: The target's purity, dimensions, composition ratio, and bonding type must be confirmed against the user's deposition system before ordering to avoid compatibility issues.
- Optional bonding and backing plate: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate are optional; selection depends on system thermal and mechanical constraints, adding a specification step.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
