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Copper Backing Target
Product Type: Round copper backing target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This copper backing target is supplied with a machined surface finish and specified dimensional tolerances. Its use requires protecting the bond interface and confirming compatibility with the intended sputtering target assembly.
- Surface Protection: Handle the backing plate by its edges and keep the machined surface protected from scratches, abrasion, or contamination.
- Dimensional Verification: Verify the backing plate dimensions against the target assembly before bonding to prevent mechanical mismatch.
- Packaging and Storage: Maintain the vacuum-sealed packaging until installation to limit surface oxidation and contamination.
- Bonding Confirmation: Confirm the specified bonding method before mounting the backing plate with the sputtering target.
What is the significance of the 1.68 micro-ohm cm electrical resistivity in a copper backing target for sputtering applications?
The 1.68 micro-ohm cm electrical resistivity ensures efficient thermal conduction and minimal electrical resistance, which is critical for heat dissipation and stable sputtering conditions. This specification is confirmed by batch COA and is directly tied to the product's role in thermal conduction and mechanical support for sputtering targets.
How does the surface roughness (Ra<=1.6 um) of the copper backing target impact bonding with the sputtering target material?
The specified surface finish, achieved by turning/grinding with Ra<=1.6 um, provides an optimal bonding surface for structures such as the Cu backing plate/magnetic shim. This ensures good thermal and mechanical contact, which is essential for reliable sputtering target support and heat transfer.
What storage conditions are recommended for a 99.999% purity copper backing target to maintain its performance?
The product is shipped vacuum packed with a Certificate of Analysis (COA) to prevent oxidation and contamination. Final parameters are confirmed by batch inspection, and storage in a dry, inert environment is implied by the vacuum packaging to preserve the 99.999% purity and Ra<=1.6 um surface condition.
This 99.999% purity round copper backing target, offered in a 1 mm thickness and 50.8 mm diameter, is specified for thermal conduction and mechanical support of sputtering targets. Its 8.96 g/cm³ density, 1.68 micro-ohm cm electrical resistivity, typical Ra ≤ 1.6 μm surface finish, and ±0.10 mm dimensional tolerances are relevant for controlled sputtering workflows, though batch parameters and bonding configuration must be confirmed before quotation.
Positive
- High-purity 99.999% copper: The 99.999% purity copper backing target is specified for controlled sputtering workflows, with typical total critical impurities confirmed by batch COA.
- Thermal and mechanical sputter support: With 8.96 g/cm³ density and 1.68 micro-ohm cm electrical resistivity, the round copper backing target is designed for thermal conduction and mechanical support of sputtering targets.
Trade-offs
- Limited standard thickness and diameter: The listed available configuration is restricted to 1 mm thickness and 50.8 mm diameter, so other dimensional requirements must be reviewed and agreed before quotation.
- Pre-quotation compatibility verification required: Model, working range, sputtering system compatibility, consumables, and required configuration must be confirmed before quotation because final parameters are batch-confirmed and configuration-dependent.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
