Lead Round Planar Sputtering Target 99.995% ATOMFAIR®

Price range: $80.00 through $175.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Pb 4N5 round planar lead sputtering target, 99.995% purity, 3-6.35 mm thickness and 25.4-101.6 mm diameters, Ra≤1.6 μm. Order now.

SKU: AF-MT-S-LEAD-N45X-VNMD
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High Purity Lead Sputtering Target, 99.995%
Product Type: Round planar sputtering target
Research-grade laboratory product
Product Overview

High Purity Lead Sputtering Target, 99.995% is a round planar sputtering target with 99.995% purity, 11.34 g/cm^3 density and 20.6 micro-ohm cm electrical resistivity for low-melting-point materials, semiconductor/functional filmsresearch.

Available configurations cover thicknesses of 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm and diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm. The listed surface condition, dimensional tolerance and bonding options support configuration review before quotation.

Performance Features
  • 99.995% purity material grade for controlled sputtering workflows.
  • Round planar sputtering target geometry with the listed thickness and diameter options.
  • Surface preparation: Turning / grinding,Ra<=1.6 um (typical).
  • Typical use areas include low-melting-point materials, semiconductor/functional filmsresearch.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-PB-99N995
Purity 99.995%
Material Grade Pb 4N5
Typical Total Critical Impurities Typical total critical impurities: <=50 ppm
Density 11.34 g/cm^3
Electrical Resistivity 20.6 micro-ohm cm
Surface State Turning / grinding,Ra<=1.6 um (typical)
Dimensional Tolerance Diameter+/-0.10 mm; thickness+/-0.10 mm (typical)
Target Type Round planar sputtering target
Bonding Unbonded; optionalCubacking plate bonding
Typical Applications low-melting-point materials, semiconductor/functional filmsresearch
Packaging / Notes Vacuum packed with COA; final parameters are confirmed by batch inspection and the agreed configuration.
Available Thicknesses 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm
Available Diameters 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm
PROCUREMENT CHECK: Confirm model, working range, compatibility, consumables and required configuration before quotation.
DOCUMENTATION REVIEW: Product specifications and configuration details are reviewed against laboratory use requirements.
ACCESSORY MATCHING: Compatible accessories, replacement parts and consumables can be matched according to the selected configuration.
INQUIRY NOTE: Include the required model, configuration and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

The target is supplied with a turned or ground surface and dimensional tolerances that must be preserved through handling and installation. Bonding and configuration options must be confirmed before the target is mounted in a deposition system.

  • Surface finish preservation: Preserve the turned or ground target face with Ra≤1.6 µm typical until installation.
  • Dimensional verification: Verify the target diameter and thickness against the stated ±0.10 mm typical tolerances before installation.
  • Bonding configuration: Select copper (Cu) backing plate bonding during quotation when the deposition system requires a bonded target.
  • Configuration compatibility review: Confirm the model, working range, compatibility, consumables, and required configuration before requesting quotation support.

What is the maximum total critical impurity level for the 99.995% lead sputtering target, and how does it affect film purity in semiconductor research?

The typical total critical impurities are ≤50 ppm for this Pb 4N5 grade target. This low impurity threshold ensures minimal contamination during sputter deposition, which is critical for maintaining controlled stoichiometry in semiconductor or functional thin-film research where trace elements can alter electrical or optical properties.

Can this unbonded lead sputtering target be directly mounted in a standard planar magnetron, or is backplate bonding required?

The target is supplied unbonded by default, with optional Cu backing plate bonding available. For direct mounting in a standard planar magnetron, unbonded targets require a compatible backing plate or clamping system to ensure thermal and electrical contact; the optional bonding service provides a ready-to-mount assembly. Confirm compatibility with your sputter gun before ordering.

What surface roughness and dimensional tolerances are typical for this lead sputtering target, and do they vary with thickness or diameter?

The target has a turned/ground surface with Ra ≤1.6 µm typical, and dimensional tolerances of ±0.10 mm for both diameter and thickness. These specifications are typical across all available thicknesses (3–6.35 mm) and diameters (25.4–101.6 mm), but final parameters are confirmed by batch inspection and the agreed configuration.

The Atomfair AF-PB-99N995 is a 99.995% pure round planar lead sputtering target with Pb 4N5 grade, 11.34 g/cm³ density, 20.6 micro-ohm cm resistivity, Ra≤1.6 μm typical surface finish, and ±0.10 mm typical dimensional tolerances. It is available with unbonded or optional Cu backing plate bonding across multiple diameters and thicknesses for low-melting-point and semiconductor/functional film research.

Positive

  • 99.995% Pb 4N5 purity grade: Typical total critical impurities are ≤50 ppm, providing controlled material purity for reproducible sputtering of low-melting-point and semiconductor/functional films.
  • Broad round planar geometry options: Available thicknesses from 3 mm to 6.35 mm and diameters from 25.4 mm to 101.6 mm, with ±0.10 mm typical dimensional tolerance, allow matching to different sputtering tool configurations.

Trade-offs

  • Unbonded by default; bonding must be specified: The target is supplied unbonded with optional Cu backing plate bonding, so the thermal and electrical contact configuration must be confirmed before quotation to suit the destination sputtering system.
  • Typical values require pre-order confirmation: Surface finish Ra≤1.6 μm and dimensional tolerance ±0.10 mm are listed as typical, with final parameters confirmed by batch inspection and the agreed configuration, requiring explicit verification against application needs.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Thickness

3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm

Diameter

25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm