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High Purity Tantalum Sputtering Target, 99.95%
Product Type: Round planar sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What is the significance of the 99.95% purity and 13.1 micro-ohm cm electrical resistivity for tantalum sputtering targets in barrier layer applications?
The 99.95% purity (Ta 3N5 grade) with typical total critical impurities ≤500 ppm ensures minimal contamination during sputtering, critical for barrier layers in electronic devices. The low electrical resistivity of 13.1 micro-ohm cm supports efficient magnetron sputtering and consistent film conductivity.
What bonding options are available for this tantalum target, and how do they affect compatibility with different sputtering systems?
The target is supplied unbonded by default, with optional Cu backing plate bonding available. Unbonded targets require end-user mounting, while Cu backing plate bonding provides thermal management for high-power magnetron sputtering. Dimensional tolerances of diameter +/-0.10 mm and thickness +/-0.10 mm ensure compatibility with standard sputtering gun assemblies.
How should the tantalum sputtering target be stored and handled to maintain its surface quality and performance?
The target is vacuum packed with a Certificate of Analysis (COA) to prevent oxidation and contamination. The surface condition (turning/grinding, Ra≤1.6 μm typical) requires careful handling to avoid scratches or contamination. Storage in a dry, inert atmosphere is recommended to preserve the 99.95% purity and low electrical resistivity.
High-purity Ta 3N5 round planar sputtering target with 99.95% purity, 16.69 g/cm3 density, 13.1 micro-ohm cm resistivity, and Ra<=1.6 um surface finish, supplied unbonded with optional Cu backing plate bonding and +/-0.10 mm diameter/thickness tolerance for reproducible barrier-layer and magnetron sputtering deposition.
Positive
- 99.95% tantalum with <=500 ppm impurities: Ta 3N5 grade with typical total critical impurities <=500 ppm supports controlled sputtering workflows for barrier layers, electronic devices, and high-temperature films.
- Precision round planar geometry and sizing: Round planar target with diameter/thickness tolerance of +/-0.10 mm and Ra<=1.6 um surface finish provides predictable mounting and sputtering characteristics across multiple diameter and thickness options.
Trade-offs
- Unbonded default requires backing plate decision: Target ships unbonded; if the application needs copper backing plate mounting or cooling, bonding must be explicitly requested as an option and confirmed before quotation.
- Confirm configuration and tolerances before order: Surface state, dimensional tolerance, and final parameters are listed as typical and are confirmed by batch inspection and agreed configuration, so model, working range, compatibility, and consumables must be reviewed before quotation.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
