|
High Purity Molybdenum Sputtering Target, 99.95%
Product Type: Round planar sputtering target
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||||||
|
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
|
Molybdenum sputtering target supplied as a vacuum-packed, dimensionally controlled planar piece with optional copper backing plate bonding. Handling must preserve surface finish and configuration agreement until installation.
- Storage and packaging: Maintain the target in its vacuum packaging with the certificate of analysis until immediately before installation to preserve the machined surface condition.
- Surface protection: Keep the machined sputtering surface protected from abrasion and particulate contamination because the as-supplied finish is specified as turned or ground.
- Configuration verification: Verify the selected thickness, diameter, and bonding option against the sputtering system requirements before opening the packaging.
- Bonding compatibility: Confirm whether the unbonded target or copper-backed bonded assembly is required for the intended sputtering system before ordering or installation.
What is the significance of the 5.30 micro-ohm cm electrical resistivity for this molybdenum sputtering target in high-temperature film applications?
The 5.30 micro-ohm cm electrical resistivity indicates low bulk resistance, which is critical for high-temperature films and conductive layers because it minimizes Joule heating and ensures efficient electron transport during sputtering. This performance is supported by the 99.95% purity (Mo 3N5 grade) and 10.28 g/cm³ density, which together yield consistent film properties in barrier and electrode applications.
What dimensional tolerances apply to this molybdenum target and how do they affect compatibility with standard sputtering cathodes?
The target has a diameter tolerance of +/-0.10 mm and a thickness tolerance of +/-0.10 mm (typical), which ensures mechanical fit into standard round planar cathode assemblies. The surface finish is Ra ≤ 1.6 μm (turning/grinding), and the unbonded configuration allows for custom Cu backing plate bonding if required. These specifications are consistent with common research-grade sputtering system requirements.
What are the handling and storage requirements for this molybdenum sputtering target to maintain its 99.95% purity and surface condition?
The target is vacuum packed with a Certificate of Analysis to preserve the 99.95% purity and Ra ≤ 1.6 μm surface finish. For long-term storage, it should be kept in a dry, inert atmosphere to prevent oxidation. The unbonded state requires careful handling to avoid surface scratches or contamination before installation.
This 99.95% purity molybdenum round planar target offers a density of 10.28 g/cm3 and electrical resistivity of 5.30 micro-ohm cm, with typical surface roughness Ra≤1.6 µm and diameter/thickness tolerance of ±0.10 mm. It is suited for high-temperature films, conductive layers, barrier layers, and electronic-device sputtering, but ships unbonded unless optional Cu backing-plate bonding is specified.
Positive
- Controlled purity and impurity budget: Mo 3N5 grade with 99.95% purity and typical total critical impurities ≤500 ppm supports reproducible sputtering of high-temperature films, conductive layers, and barrier layers in electronic devices.
- Round planar geometry with tight tolerances: Diameter options from 25.4 mm to 101.6 mm and thicknesses from 3 mm to 6.35 mm, with typical diameter/thickness tolerance ±0.10 mm and Ra≤1.6 µm surface finish, enable integration into standard planar magnetron sputtering fixtures.
Trade-offs
- Unbonded by default; Cu backing optional: The target is supplied unbonded, so thermal management during high-power sputtering requires the buyer to either request the optional Cu backing-plate bonding or implement an alternative thermal interface.
- Typical specs require pre-order confirmation: Surface condition and dimensional tolerances are listed as typical, and final parameters are confirmed by batch inspection; the exact configuration must be reviewed and agreed before quotation to avoid dimensional mismatch.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
