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High Purity Tungsten Sputtering Target, 99.999%
Product Type: Round planar sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What are the specified purity, impurity, density, and resistivity values for the AF-W-99N999 99.999% tungsten sputtering target?
The target is specified as 99.999% purity with a W 4N5 material grade and typical total critical impurities of <=10 ppm. Density is 19.25 g/cm3 and electrical resistivity is 5.60 micro-ohm cm. These values support controlled sputtering for high-temperature films, hard coatings, barrier layers, and electronic devices.
Which diameters, thicknesses, and bonding configurations are available for this round planar tungsten sputtering target?
Available thicknesses are 3 mm, 4 mm, 5 mm, 6 mm, and 6.35 mm, with diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, and 100 mm. The target is supplied unbonded as standard, with optional Cu backing plate bonding. Dimensional tolerance is diameter +/-0.10 mm and thickness +/-0.10 mm, typical.
What surface finish and packaging are provided for this tungsten target before installation?
The target surface is prepared by turning or grinding with Ra <=1.6 um, typical. It is vacuum packed with a Certificate of Analysis, and final parameters are confirmed by batch inspection and the agreed configuration. Confirm model, configuration, and bonding requirements before quotation.
This 99.999% pure tungsten sputtering target offers high density (19.25 g/cm³) and low electrical resistivity (5.60 μΩ·cm) for demanding high-temperature film, hard coating, and barrier layer applications. Available in multiple thickness and diameter configurations, it requires careful consideration of dimensional tolerances and bonding options for optimal system integration.
Positive
- Ultra-high purity with controlled impurities: 99.999% purity grade with total critical impurities ≤10 ppm ensures reproducible film stoichiometry and minimizes contamination in sensitive sputtering processes.
- High density for efficient sputtering: Density of 19.25 g/cm³ maximizes atomic packing and sputter yield, beneficial for dense, void-free thin films in hard coatings and barrier layers.
Trade-offs
- Surface roughness may limit uniformity: Typical surface roughness Ra ≤ 1.6 μm (turned/ground) is acceptable for many applications but may not meet ultra-smooth film requirements in advanced optical or electronic devices without additional polishing.
- Unbonded by default requires separate bonding: The target is supplied unbonded; optional backing plate bonding must be specified during quotation. Users must account for bonding step if direct mounting to a sputter cathode is needed.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
