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High Purity Tungsten Sputtering Target, 99.95%
Product Type: Round planar sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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What performance characteristics make this 99.95% tungsten sputtering target suitable for high-temperature films and barrier layers?
The target is specified at 99.95% purity (W 3N5) with typical total critical impurities <=500 ppm, a density of 19.25 g/cm^3, and an electrical resistivity of 5.60 micro-ohm cm. These parameters support controlled sputtering workflows for high-temperature films, hard coatings, barrier layers, and electronic devices. Final film behavior also depends on the deposition process and chamber configuration.
What mounting and bonding options are available for this round planar tungsten target?
The target is supplied unbonded by default, with optional Cu backing plate bonding available as a configuration choice. Available thicknesses are 3 mm, 4 mm, 5 mm, 6 mm, and 6.35 mm; available diameters are 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 100 mm, and 101.6 mm. Dimensional tolerance is diameter +/-0.10 mm and thickness +/-0.10 mm (typical), so the exact configuration should be reviewed before quotation.
What packaging, inspection, and configuration documentation should be expected before using this tungsten sputtering target?
The target is vacuum packed with a certificate of analysis (COA), and final parameters are confirmed by batch inspection and the agreed configuration. The listed surface condition is turning/grinding with Ra<=1.6 um (typical). Procurement should confirm model, working range, compatibility, consumables, and required configuration before quotation.
This round planar tungsten sputtering target is specified as 99.95% pure W 3N5 with a density of 19.25 g/cm³ and electrical resistivity of 5.60 micro-ohm cm for high-temperature films, hard coatings, barrier layers, and electronic device deposition. The available thickness and diameter matrix, Ra≤1.6 μm machined surface, and ±0.10 mm typical dimensional tolerance make it suitable for configuration-matched sputtering system integration, with the unbonded delivery and optional Cu backing plate bonding as the key process decision.
Positive
- 3N5 purity with low critical impurities: 99.95% tungsten (W 3N5) with typical total critical impurities ≤500 ppm provides a defined material grade for controlled sputtering workflows in high-temperature, hard-coating, and barrier-layer applications.
- Precision-machined round planar geometry: Turning/ground surface finish with Ra≤1.6 μm and typical diameter/thickness tolerance of ±0.10 mm supports reproducible surface condition and dimensional fit for round planar sputtering cathode configurations.
Trade-offs
- Unbonded unless Cu backing specified: The target is supplied unbonded with optional Cu backing plate bonding, so the buyer must confirm bonding requirements for thermal management and mounting compatibility before deployment.
- Specifications are typical per batch: Surface roughness, dimensional tolerance, and impurity values are typical and final parameters are confirmed by batch inspection and the agreed configuration, requiring technical validation for application-specific limits.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
