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High Purity Indium Sputtering Target, 99.995%
Product Type: Round planar sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document specifies the product-specific constraints for receiving, storing, and configuring the round planar indium sputtering target before installation. Adherence to these constraints preserves the machined surface finish and dimensional integrity required for controlled sputtering workflows.
- Surface State Preservation: Preserve the machined turning/grinding surface finish by avoiding mechanical abrasion, particulates, and unprotected contact after unpacking.
- Dimensional Verification: Confirm that the target diameter and thickness match the sputtering chamber mounting fit before installation.
- Bonding Configuration: Select the unbonded or optional Cu backing plate bonding option according to the sputter tool's mounting interface requirements.
- Packaging and Storage: Retain the vacuum-packed packaging and the certificate of analysis until immediately before installation to minimize exposure of the high-purity surface.
- Batch Acceptance: Confirm final parameters by batch inspection and the agreed configuration before initiating deposition runs.
Complete the configuration review and procurement steps before mounting the indium target in a sputtering system. Confirm the target model, required dimensions, and bonding option against the laboratory application requirements.
- Confirm target configuration
Confirm the target model, working range, compatibility, consumables, and required configuration before quotation. - Review specifications
Review the product specifications and configuration details against the laboratory use requirements. - Match accessories
Match compatible accessories, replacement parts, and consumables according to the selected configuration. - Request quotation support
Include the required model, configuration, and quantity when requesting quotation support.
What is the typical total critical impurity level for the Atomfair 99.995% indium sputtering target, and how does it affect film quality?
The typical total critical impurities are ≤50 ppm for the In 4N5 grade target. This low impurity level is essential for achieving consistent electrical resistivity (8.37 micro-ohm cm) and minimizing defect formation in transparent conductive films and electronic device layers, ensuring reproducible sputtering performance.
Can the Atomfair indium sputtering target be bonded to a copper backing plate, and what are the dimensional tolerances for integration?
Yes, the target is available unbonded or with optional copper backing plate bonding. The dimensional tolerance is diameter ±0.10 mm and thickness ±0.10 mm, which supports precise fit into standard sputtering systems. Bonding configuration must be confirmed during quotation to ensure thermal and mechanical compatibility.
What surface finish and handling precautions are required for the Atomfair indium sputtering target before installation?
The target surface is prepared by turning/grinding to a typical roughness Ra ≤1.6 μm. It is vacuum packed with a Certificate of Analysis (COA) to prevent oxidation. Users should handle the target in a clean, dry environment and avoid exposing the surface to moisture or contaminants prior to installation to maintain sputtering uniformity.
This variable-configuration round planar indium sputtering target is specified at 99.995% purity (In 4N5, <=50 ppm typical critical impurities), with available diameters from 25.4 to 101.6 mm and thicknesses from 3 to 6.35 mm, and a turned/ground surface at Ra<=1.6 um. It is shipped unbonded unless Cu backing plate bonding is requested, so mounting configuration must be confirmed before ordering.
Positive
- 4N5 purity with low critical impurities: The 99.995% indium grade (In 4N5) with typical total critical impurities <=50 ppm supports controlled sputtering workflows for transparent conductive films, low-melting-point materials, and electronic devices.
- Tight dimensional and surface control: Diameter and thickness tolerances of +/-0.10 mm with a turned/ground surface finish of Ra<=1.6 um provide predictable target geometry and surface condition for planar sputtering system integration.
Trade-offs
- Unbonded by default: The target is supplied unbonded unless Cu backing plate bonding is specified, so the buyer must confirm mounting and bonding requirements with the intended sputtering system before quotation.
- Batch-confirmed final parameters: Surface condition and dimensional tolerance are typical values, and final parameters are confirmed by batch inspection and the agreed configuration, requiring configuration review before ordering.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
