Zinc Round Planar Sputtering Target 99.995% ATOMFAIR®

Price range: $80.00 through $175.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Zn 4N5 round planar sputtering target, 99.995% purity, 3–6.35 mm thick and 25.4–101.6 mm diameter, Ra≤1.6 μm, vacuum packed with COA. Order now.

SKU: AF-MT-S-ZINC-N45X-4S2I
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High Purity Zinc Sputtering Target, 99.995%
Product Type: Round planar sputtering target
Research-grade laboratory product
Product Overview

High Purity Zinc Sputtering Target, 99.995% is a round planar sputtering target with 99.995% purity, 7.14 g/cm^3 density and 5.90 micro-ohm cm electrical resistivity for magnetron sputtering, reactive sputtering, ZnO film deposition.

Available configurations cover thicknesses of 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm and diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm. The listed surface condition, dimensional tolerance and bonding options support configuration review before quotation.

Performance Features
  • 99.995% purity material grade for controlled sputtering workflows.
  • Round planar sputtering target geometry with the listed thickness and diameter options.
  • Surface preparation: Turning / grinding,Ra<=1.6 um (typical).
  • Typical use areas include magnetron sputtering, reactive sputtering, ZnO film deposition.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-ZN-99N995
Purity 99.995%
Material Grade Zn 4N5
Typical Total Critical Impurities Typical total critical impurities: <=50 ppm
Density 7.14 g/cm^3
Electrical Resistivity 5.90 micro-ohm cm
Surface State Turning / grinding,Ra<=1.6 um (typical)
Dimensional Tolerance Diameter+/-0.10 mm; thickness+/-0.10 mm (typical)
Target Type Round planar sputtering target
Bonding Unbonded; optionalCubacking plate bonding
Typical Applications magnetron sputtering, reactive sputtering, ZnO film deposition
Packaging / Notes Vacuum packed with COA; final parameters are confirmed by batch inspection and the agreed configuration.
Available Thicknesses 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm
Available Diameters 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm
PROCUREMENT CHECK: Confirm model, working range, compatibility, consumables and required configuration before quotation.
DOCUMENTATION REVIEW: Product specifications and configuration details are reviewed against laboratory use requirements.
ACCESSORY MATCHING: Compatible accessories, replacement parts and consumables can be matched according to the selected configuration.
INQUIRY NOTE: Include the required model, configuration and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This round planar zinc target is supplied for controlled sputtering workflows and requires verification of surface finish, dimensional tolerance, and bonding configuration before use. Target integrity depends on maintaining the vacuum-sealed packaging and confirming batch inspection data with the certificate of analysis.

  • Surface finish constraint: Confirm the turned or ground target surface meets Ra <= 1.6 um typical to avoid introducing particulates during sputtering.
  • Dimensional tolerance constraint: Verify the selected diameter and thickness are within +/-0.10 mm typical to ensure correct seating in the sputter source.
  • Bonding configuration constraint: Select unbonded or Cu-backing-plate-bonded mounting according to the sputter source and confirm the agreed configuration before installation.
  • Packaging integrity constraint: Inspect the vacuum packaging and certificate of analysis on receipt to confirm batch identity and package integrity before opening.

What material-grade and electrical properties are specified for the Atomfair AF-ZN-99N995 zinc sputtering target?

The AF-ZN-99N995 is a 99.995% (Zn 4N5) round planar zinc sputtering target with a density of 7.14 g/cm3 and an electrical resistivity of 5.90 micro-ohm cm. Typical total critical impurities are <=50 ppm, and the product is intended for controlled magnetron sputtering, reactive sputtering, and ZnO film deposition workflows.

What dimensions and tolerances are available for the AF-ZN-99N995 round planar target, and what surface finish is supplied?

Available thicknesses are 3, 4, 5, 6, and 6.35 mm; available diameters are 25.4, 50, 50.8, 60, 76.2, 80.0, 101.6, and 100 mm. The surface is turned/ground with Ra <= 1.6 um typical, and diameter tolerance is +/-0.10 mm while thickness tolerance is +/-0.10 mm typical. Confirm the working range and compatibility before quotation.

Is the zinc target supplied bonded to a backing plate, and how is it packaged for delivery?

The target is unbonded as standard, with optional Cu backing plate bonding if a bonded configuration is required. It is vacuum packed with a COA, and final parameters are confirmed by batch inspection and the agreed configuration; bonding and packaging should be confirmed before quotation.

This 99.995% Zn round planar sputtering target offers Zn 4N5 grade purity with <=50 ppm typical total critical impurities, 5.90 micro-ohm cm resistivity, Ra<=1.6 um surface finish, and +/-0.10 mm dimensional tolerances for controlled magnetron and reactive sputtering of ZnO films; the unbonded default and configuration-dependent final parameters require bonding and dimensional confirmation before installation.

Positive

  • 4N5 purity with low critical impurities: 99.995% purity Zn with typical total critical impurities <=50 ppm supports controlled magnetron sputtering, reactive sputtering, and ZnO film deposition workflows.
  • Precision geometry and surface finish: Turning/grinding surface preparation to Ra<=1.6 um and diameter/thickness tolerances of +/-0.10 mm (typical) provide predictable planar target geometry for mounting and sputter uniformity.

Trade-offs

  • Unbonded backing plate default: Targets are supplied unbonded with Cu backing plate bonding optional, so users must specify and confirm bonding service separately before installation in magnetron sputtering systems.
  • Final parameters require configuration confirmation: Delivery is vacuum packed with a COA, but final parameters are confirmed by batch inspection and the agreed configuration; model, dimensions, and compatibility must be verified before quotation.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Thickness

3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm

Diameter

25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm