Copper Round Sputtering Target 99.9995% Cu 5N5 ATOMFAIR®

Price range: $90.00 through $200.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Cu 5N5 round planar sputtering target, 99.9995% purity, 3-6.35 mm thick and 25.4-101.6 mm dia, Ra≤1.6 μm, vacuum packed with COA.

SKU: AF-MT-S-COPP-N55X-H4H7
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High Purity Copper Sputtering Target, 99.9995%
Product Type: Round planar sputtering target
Research-grade laboratory product
Product Overview

High Purity Copper Sputtering Target, 99.9995% is a round planar sputtering target with 99.9995% purity, 8.96 g/cm^3 density and 1.68 micro-ohm cm electrical resistivity for conductive films, interconnect layers, electronic devices, magnetron sputtering.

Available configurations cover thicknesses of 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm and diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm. The listed surface condition, dimensional tolerance and bonding options support configuration review before quotation.

Performance Features
  • 99.9995% purity material grade for controlled sputtering workflows.
  • Round planar sputtering target geometry with the listed thickness and diameter options.
  • Surface preparation: Turning / grinding,Ra<=1.6 um (typical).
  • Typical use areas include conductive films, interconnect layers, electronic devices, magnetron sputtering.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-CU-99N9995
Purity 99.9995%
Material Grade Cu 5N5
Typical Total Critical Impurities Typical total critical impurities: <=5 ppm
Density 8.96 g/cm^3
Electrical Resistivity 1.68 micro-ohm cm
Surface State Turning / grinding,Ra<=1.6 um (typical)
Dimensional Tolerance Diameter+/-0.10 mm; thickness+/-0.10 mm (typical)
Target Type Round planar sputtering target
Bonding Unbonded; optionalCubacking plate bonding/magnetic shim
Typical Applications conductive films, interconnect layers, electronic devices, magnetron sputtering
Packaging / Notes Vacuum packed with COA; final parameters are confirmed by batch inspection and the agreed configuration.
Available Thicknesses 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm
Available Diameters 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm
PROCUREMENT CHECK: Confirm model, working range, compatibility, consumables and required configuration before quotation.
DOCUMENTATION REVIEW: Product specifications and configuration details are reviewed against laboratory use requirements.
ACCESSORY MATCHING: Compatible accessories, replacement parts and consumables can be matched according to the selected configuration.
INQUIRY NOTE: Include the required model, configuration and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This document defines handling and configuration constraints for the round planar copper sputtering target supplied at 99.9995% purity. The stated surface finish, dimensional tolerance, vacuum packaging, and bonding provisions must be preserved through installation.

  • Surface state constraint: The active sputtering face is turned or ground to a typical Ra of not more than 1.6 micrometers and must be protected from abrasion and contamination after unpacking.
  • Dimensional verification: The target diameter and thickness are held to a typical tolerance of plus or minus 0.10 millimeters and should be confirmed against the agreed configuration before mounting.
  • Packaging preservation: Keep the target vacuum sealed until immediately before installation to prevent surface oxidation and particulate pickup.
  • Bonding configuration: Select unbonded, copper backing plate bonding, or magnetic shim integration before installation because the mounting method must be finalized before quotation and use.

What is the typical total critical impurity level for the 99.9995% copper sputtering target and how does it affect film quality?

The typical total critical impurities are ≤5 ppm, as specified for the Cu 5N5 grade. This ultra-low impurity level minimizes contamination in deposited conductive films, which is critical for maintaining consistent electrical resistivity (1.68 μΩ·cm) in interconnect layers and electronic device applications.

Can this copper sputtering target be bonded to a backing plate for magnetron sputtering systems?

Yes, the target is available unbonded by default, but optional Cu backing plate bonding or magnetic shim bonding is offered. This allows integration with magnetron sputtering systems that require thermal or magnetic coupling, though the specific bonding configuration must be confirmed during procurement.

What dimensional tolerances and surface finish are guaranteed for this round planar sputtering target?

The diameter tolerance is ±0.10 mm and thickness tolerance is ±0.10 mm (typical), with a surface finish of Ra ≤1.6 μm from turning/grinding. These specifications ensure consistent fitment in standard sputtering gun assemblies and uniform erosion profiles during deposition.

The Atomfair High Purity Copper Sputtering Target (99.9995%) is a round planar target with a density of 8.96 g/cm³ and electrical resistivity of 1.68 μΩ·cm, suitable for conductive films and interconnect layers in magnetron sputtering systems. Its 5N5 purity grade and ≤5 ppm total critical impurities support controlled deposition workflows, while the unbonded default and optional bonding configurations require careful compatibility assessment with the user's sputtering system.

Positive

  • Ultra-high 99.9995% purity grade: The 5N5 purity with ≤5 ppm total critical impurities minimizes contamination in conductive film and interconnect layer deposition, critical for electronic device performance.
  • Low electrical resistivity for sputtering: With 1.68 μΩ·cm resistivity and 8.96 g/cm³ density, the target supports efficient magnetron sputtering for uniform, high-conductivity films.

Trade-offs

  • Unbonded default requires bonding assessment: The target ships unbonded; optional backing plate bonding or magnetic shim must be specified, adding a configuration step to ensure thermal and mechanical compatibility with the sputtering system.
  • Surface roughness may affect film uniformity: The as-machined surface finish (Ra ≤1.6 μm typical) may require pre-conditioning or burn-in for applications demanding ultra-smooth initial deposition layers.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Thickness

3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm

Diameter

25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm