Iron Sputtering Target 99.95% Fe 3N5 Round ATOMFAIR®

Price range: $60.00 through $160.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Fe 3N5 round planar iron sputtering target, 99.95% purity with 1-6.35 mm thicknesses, 25.4-101.6 mm diameters and Ra≤1.6 μm finish. Order now.

SKU: AF-MT-S-IRON-N35X-GN9N
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High Purity Iron Sputtering Target, 99.95%
Product Type: Round planar sputtering target
Research-grade laboratory product
Product Overview

High Purity Iron Sputtering Target, 99.95% is a round planar sputtering target with 99.95% purity, 7.87 g/cm^3 density and 9.71 micro-ohm cm electrical resistivity for magnetic films, iron-basedfunctional films, magnetron sputtering.

Available configurations cover thicknesses of 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm, 2 mm, 1.5 mm, 1 mm and diameters of 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm, 80 mm. The listed surface condition, dimensional tolerance and bonding options support configuration review before quotation.

Performance Features
  • 99.95% purity material grade for controlled sputtering workflows.
  • Round planar sputtering target geometry with the listed thickness and diameter options.
  • Surface preparation: Turning / grinding,Ra<=1.6 um (typical).
  • Typical use areas include magnetic films, iron-basedfunctional films, magnetron sputtering.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-FE-99N95
Purity 99.95%
Material Grade Fe 3N5
Typical Total Critical Impurities Typical total critical impurities: <=500 ppm
Density 7.87 g/cm^3
Electrical Resistivity 9.71 micro-ohm cm
Surface State Turning / grinding,Ra<=1.6 um (typical)
Dimensional Tolerance Diameter+/-0.10 mm; thickness+/-0.10 mm (typical)
Target Type Round planar sputtering target
Bonding Unbonded; optionalCubacking plate bonding/magnetic shim
Typical Applications magnetic films, iron-basedfunctional films, magnetron sputtering
Packaging / Notes Vacuum packed with COA; final parameters are confirmed by batch inspection and the agreed configuration.
Available Thicknesses 3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm, 2 mm, 1.5 mm, 1 mm
Available Diameters 25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm, 80 mm
PROCUREMENT CHECK: Confirm model, working range, compatibility, consumables and required configuration before quotation.
DOCUMENTATION REVIEW: Product specifications and configuration details are reviewed against laboratory use requirements.
ACCESSORY MATCHING: Compatible accessories, replacement parts and consumables can be matched according to the selected configuration.
INQUIRY NOTE: Include the required model, configuration and quantity when requesting quotation support.
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This target is supplied unbonded and vacuum packed with a certificate of analysis; final parameters are confirmed by batch inspection and the agreed configuration. Diameter and thickness tolerances are ±0.10 mm typical, with a turned or ground surface finish of Ra ≤1.6 µm typical.

  • Configuration Confirmation: Confirm the required model, working range, compatibility, consumables, and target configuration with the technical sales team before quotation.
  • Dimensional Verification: Verify that the selected diameter and thickness match the sputter source geometry within the stated ±0.10 mm typical tolerance.
  • Surface Inspection: Inspect the turned or ground target surface before installation because the specified finish is Ra ≤1.6 µm typical.
  • Bonding Selection: Select unbonded, copper backing plate bonded, or magnetic shim mounting according to the sputter chamber configuration.
  • Packaging Retention: Keep the target vacuum packed with its certificate of analysis until the agreed configuration is confirmed.

What are the purity, density, and electrical resistivity of the Atomfair 99.95% iron sputtering target?

The Atomfair AF-FE-99N95 iron sputtering target is supplied at 99.95% purity (Fe 3N5 grade) with typical total critical impurities <=500 ppm. Its density is 7.87 g/cm^3 and its electrical resistivity is 9.71 micro-ohm cm, making it suitable for controlled magnetron sputtering of magnetic and iron-based functional films.

Is this iron sputtering target supplied bonded or unbonded, and what mounting options are available?

This round planar iron target is supplied unbonded by default. Optional Cu backing plate bonding or a magnetic shim is available, allowing the target to be configured for magnetron sputtering cathode integration and magnetic film deposition workflows.

What dimensional tolerances, surface finish, and packaging apply to the Atomfair iron sputtering target?

The target has typical dimensional tolerances of diameter +/-0.10 mm and thickness +/-0.10 mm, with a turned/ground surface finish of Ra<=1.6 um. It is vacuum packed with a certificate of analysis, and final parameters are confirmed by batch inspection and the agreed configuration.

The Atomfair AF-FE-99N95 round planar iron sputtering target is supplied as an Fe 3N5 grade, 99.95% purity item with typical total critical impurities ≤500 ppm, density 7.87 g/cm³, and electrical resistivity 9.71 µΩ·cm, offered in thicknesses from 1 mm to 6.35 mm and diameters from 25.4 mm to 101.6 mm. It is appropriate for magnetic and iron-based functional film deposition by magnetron sputtering, but the unbonded standard configuration and batch-confirmed final parameters require explicit backing, bonding, and configuration review before sourcing.

Positive

  • 99.95% purity with ≤500 ppm impurities: Fe 3N5 grade material with typical total critical impurities ≤500 ppm provides a defined impurity baseline for controlled sputtering of magnetic films and iron-based functional films.
  • Precision-machined round planar geometry: Turning/grinding surface finish with Ra ≤ 1.6 µm and typical diameter/thickness tolerance of ±0.10 mm supports predictable mounting and sputter source configuration across the available thickness and diameter range.

Trade-offs

  • Unbonded standard configuration: The target is supplied unbonded; buyers must specify optional Cu backing plate bonding or magnetic shim during quotation review to meet their cathode mounting and sputtering requirements.
  • Final parameters confirmed by batch inspection: Surface finish and dimensional tolerances are typical values, with final parameters verified per batch and the agreed configuration; incoming inspection and specification confirmation are necessary before installation.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).

Thickness

3 mm, 4 mm, 5 mm, 6 mm, 6.35 mm, 2 mm, 1.5 mm, 1 mm

Diameter

25.4 mm, 50 mm, 50.8 mm, 60 mm, 76.2 mm, 80.0 mm, 101.6 mm, 100 mm, 80 mm