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High Purity Titanium Sputtering Target, 99.999%
Product Type: Round planar sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Target handling must prevent surface contamination and oxidation until the target is mounted in a vacuum deposition chamber. Dimensional tolerance and bonding configuration must be verified against the agreed order before installation.
- Vacuum Packaging Integrity: Maintain the target in its unopened vacuum packaging to preserve the prepared titanium surface prior to installation.
- Surface Preservation: Protect the turned or ground surface from contact, scratches, and contamination because the stated roughness is the as-prepared condition.
- Dimensional Verification: Confirm the target diameter and thickness against the stated +/-0.10 mm typical tolerance before mounting.
- Bonding Configuration: Select and verify the backing plate bonding method or magnetic shim option before installation to avoid mechanical or thermal mismatch.
- Certificate of Analysis Review: Review the certificate of analysis to confirm batch inspection results and final parameters before accepting the target.
These steps cover the pre-installation handling and mounting procedure for an unbonded titanium sputtering target with optional backing plate bonding. The sequence preserves surface condition and ensures configuration verification before vacuum deposition.
Required Equipment: Vacuum sputter deposition system, Backing plate or magnetic shim
- Inspect Packaging
Inspect the vacuum packaging and certificate of analysis upon receipt to confirm the target identity and sealed condition. - Store Until Mounting
Store the target in its unopened vacuum packaging until immediately before mounting to limit surface contamination. - Verify Configuration
Verify the target diameter, thickness, surface state, and selected bonding option against the agreed configuration before installation. - Mount Target
Mount the target onto the backing plate using the selected bonding option or magnetic shim configuration. - Install in System
Install the mounted target into the sputter deposition system and confirm it is secure before pumpdown.
What is the significance of the 99.999% purity and 42.0 micro-ohm cm electrical resistivity for titanium sputtering targets in barrier layer applications?
The 99.999% purity (typical total critical impurities ≤10 ppm) minimizes contamination in thin films, while the 42.0 micro-ohm cm electrical resistivity influences plasma stability and deposition rate. These parameters are critical for achieving consistent barrier layer performance in electronic devices.
What dimensional tolerances and bonding options are available for the Atomfair AF-TI-99N999 titanium sputtering target?
The target has a diameter tolerance of +/-0.10 mm and thickness tolerance of +/-0.10 mm. It is available unbonded or with optional backing plate bonding or magnetic shim to suit different sputtering system configurations. These options must be specified at quotation.
How is the high-purity titanium sputtering target packaged and what documentation is provided?
The target is vacuum packed with a Certificate of Analysis (COA) to maintain purity. Final parameters are confirmed by batch inspection, and the agreed configuration is documented. This ensures the target meets the required specifications for research-grade applications.
The High Purity Titanium Sputtering Target (99.999%) delivers excellent purity with low critical impurities (≤10 ppm) for demanding barrier layer and electronic device applications. Its wide range of available thicknesses and diameters offers flexibility, but the unbonded default and typical ±0.10 mm tolerances require careful configuration planning.
Positive
- High Purity and Low Impurities: 99.999% purity with total critical impurities ≤10 ppm, minimizing contamination in sensitive sputtering processes for barrier layers, decorative coatings, and electronic devices.
- Extensive Dimensional Range: Available in 8 diameters (25.4–101.6 mm) and 5 thicknesses (3–6.35 mm), enabling compatibility with diverse sputtering system configurations and target geometries.
Trade-offs
- Unbonded Default Configuration: Supplied unbonded; optional backing plate bonding or magnetic shim must be specified separately, adding a step for thermal management and handling integration.
- Dimensional Tolerance Consideration: Diameter and thickness tolerance of ±0.10 mm (typical) may require verification for systems with tight fit requirements, though final parameters are confirmed per batch.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
