|
High Purity Titanium Sputtering Target, 99.995%
Product Type: Round planar sputtering target
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||||||
|
LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
|
The target must be stored in a vacuum-sealed package with the certificate of analysis to prevent surface oxidation and contamination. Surface roughness and dimensional tolerances are verified per batch and must be confirmed before use to ensure consistent sputtering performance.
- Surface Contamination Risk: Exposure to ambient atmosphere after opening the vacuum package may introduce surface oxides or particulates that degrade film purity.
- Dimensional Verification Requirement: Diameter and thickness tolerances of ±0.10 mm must be confirmed against the chamber fixture to avoid mounting misalignment.
- Bonding Configuration Constraint: Unbonded targets require a compatible backing plate or magnetic shim for thermal and electrical contact during sputtering.
Inspect the vacuum-sealed package and certificate of analysis upon receipt to confirm the target matches the ordered configuration. Verify dimensional compatibility with the sputtering chamber before removing the protective packaging.
Required Equipment: Cleanroom gloves, Isopropyl alcohol and lint-free wipes, Calibrated micrometer or caliper
- Verify Package Integrity
Inspect the vacuum-sealed package for any signs of damage or loss of vacuum before opening. - Confirm Dimensions
Measure the target diameter and thickness with a calibrated micrometer to ensure they meet the specified tolerances of ±0.10 mm. - Clean Target Surface
Wipe the target surface gently with isopropyl alcohol and a lint-free wipe to remove any particulates without scratching the finish. - Mount Target in Chamber
Secure the target onto the backing plate or magnetic shim using the appropriate fasteners, ensuring uniform thermal contact. - Evacuate Chamber
Pump the sputtering chamber to the required base pressure before initiating the sputtering process.
What is the impact of the 99.995% purity and ≤50 ppm total critical impurities on the sputtering performance for barrier layer applications?
The 99.995% purity (Ti 4N5 grade) with typical total critical impurities ≤50 ppm minimizes contamination during sputtering, which is critical for barrier layers in electronic devices where impurity-induced defects can degrade performance. The electrical resistivity of 42.0 micro-ohm cm and density of 4.51 g/cm³ are consistent with high-purity titanium for controlled deposition rates.
What bonding options are available for this titanium sputtering target, and how do they affect its use in different sputtering systems?
The target is available unbonded or with optional Cu backing plate bonding or magnetic shim. Unbonded targets require separate mounting; bonded configurations with copper backing plates improve thermal conductivity and are recommended for high-power sputtering applications. The choice depends on the sputtering system's cooling and mounting requirements.
How should the high-purity titanium sputtering target be stored and handled to maintain its 99.995% purity?
The target is vacuum packed with a certificate of analysis (COA) to preserve surface quality. It should be stored in a clean, dry environment and handled with gloves to avoid contamination from oils or particulates. The surface condition (turning/grinding, Ra≤1.6 μm) is typical and should be preserved until installation.
This 99.995% Ti round planar sputtering target (AF-TI-99N995) combines 4N5 purity with defined surface finish and dimensional tolerances for barrier, decorative, hard-coating, and electronic-device sputtering, but the unbonded default and typical batch-confirmed tolerances require configuration review before deployment.
Positive
- 4N5 purity with controlled impurities: The 99.995% titanium grade limits typical total critical impurities to <=50 ppm, supporting predictable film composition in barrier, hard-coating, decorative, and electronic-device deposition processes.
- Geometric and surface consistency: Turning/grinding gives a typical surface finish of Ra<=1.6 um, and dimensional tolerance of diameter and thickness is +/-0.10 mm, providing a reproducible target geometry for vacuum sputtering systems.
Trade-offs
- Unbonded as standard: This target is supplied unbonded; users needing a Cu backing plate bond or magnetic shim must select that option at quotation, so thermal and mechanical interface planning falls to the buyer unless specified.
- Tolerances are typical values: Surface finish and +/-0.10 mm dimensional tolerances are listed as typical, and final parameters are confirmed by batch inspection and agreed configuration, so precision-critical applications require explicit pre-order confirmation.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
