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High Purity Aluminum Sputtering Target, 99.999%
Product Type: Round planar sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
For model selection, accessory matching, platform compatibility or configuration confirmation, contact our technical sales team.
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This DigitalDocument records the technical constraints and configuration checks for the Atomfair AF-AL-99N999 high-purity aluminum sputtering target. It applies to surface finish, dimensional tolerance, bonding configuration, and package integrity before installation.
- Surface State Confirmation: Confirm that the target's surface finish meets the stated turning/grinding condition with Ra<=1.6 um before installation.
- Dimensional Verification: Verify the diameter and thickness against the stated +/-0.10 mm tolerances to ensure fit with the sputtering system.
- Bonding Configuration Selection: Select unbonded, Cu backing plate bonded, or magnetic shim mounting according to the sputtering tool's configuration requirements.
- Packaging Integrity: Keep the target vacuum packed until installation and retain the certificate of analysis for traceability.
- System Compatibility Check: Confirm the target model, working range, and system compatibility before ordering or installation.
The AF-AL-99N999 round planar aluminum sputtering target provides 99.999% purity with typical total critical impurities ≤10 ppm, 2.70 g/cm³ density, and 2.65 micro-ohm cm electrical resistivity, with ±0.10 mm dimensional tolerances and Ra≤1.6 μm turned/ground surfaces; it is supplied unbonded, so Cu backing plate bonding or magnetic shim attachment must be specified during configuration review.
Positive
- 5N purity with low impurities: The 99.999% aluminum grade (Al 4N5) with typical total critical impurities ≤10 ppm supports controlled sputtering workflows where contaminant contribution to deposited conductive films must be minimized.
- Tight geometry and surface finish: Diameter and thickness tolerances of ±0.10 mm with a turned/ground surface of Ra≤1.6 μm provide reproducible dimensional fit and a consistent sputtering surface condition for round planar cathode mounting.
Trade-offs
- Unbonded target requires backing configuration: The target is supplied unbonded, so thermal and electrical contact to the cathode depends on the user specifying Cu backing plate bonding or magnetic shim attachment during the pre-quotation configuration review.
- Final parameters require configuration confirmation: Dimensional and surface specifications are typical values; final parameters are confirmed by batch inspection and the agreed configuration, requiring model, working range, and compatibility confirmation before quotation.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
