|
Cobalt-Antimony Alloy Sputtering Target (YbCoSb)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||||||
|
LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
|
This document defines the deposition and compatibility constraints for the YbCoSb sputtering target (AF-MT-YBCS) in vacuum coating workflows. It covers the specified magnetron sputtering envelope and the required configuration verification before use.
- Sputtering process envelope: Operate the target in DC or RF magnetron sputtering mode within the stated power density and argon pressure range to preserve deposition behavior.
- Configuration verification: Confirm the target purity, dimensions, composition ratio, and bonding requirements against the deposition system before installation.
- Bonding and backing plate compatibility: Verify that the selected indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate match the sputtering source's mounting configuration.
- Film integrity: Prepare substrates properly and maintain the specified thickness uniformity to achieve the stated adhesion strength in deposited films.
This procedure describes the steps needed to prepare and run the YbCoSb sputtering target in a vacuum deposition process. It focuses on configuration confirmation, process parameter selection, and deposition monitoring.
Required Equipment: DC/RF magnetron sputtering system
- Confirm target configuration
Confirm the target purity, dimensions, composition ratio, and bonding requirements against the deposition system before ordering. - Select sputtering mode
Select DC or RF magnetron sputtering mode according to the target's specified power density range. - Set process gas pressure
Set the argon pressure to the specified process range for the sputtering run. - Monitor deposition
Monitor deposition rate and thickness uniformity during the run to confirm conformance to the target process specification. - Verify film adhesion
Inspect deposited film adhesion on properly prepared substrates to verify process quality.
What is the maximum allowable oxygen and nitrogen impurity level in the YbCoSb sputtering target, and how does it affect film quality?
The YbCoSb target has a combined oxygen and nitrogen impurity limit of <200 ppm, with total metallic impurities <1000 ppm. This low O+N content minimizes oxide and nitride formation during sputtering, which is critical for maintaining stoichiometric transfer and achieving high adhesion strength >15 MPa (ASTM D4541) in deposited films.
Can this 2-inch diameter YbCoSb target be used with RF magnetron sputtering, and what are the recommended power density limits?
Yes, the target is optimized for both DC and RF magnetron sputtering. For RF sputtering, the recommended power density range is 1-5 W/cm² under a 0.5-2.0 Pa Ar atmosphere. This yields deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate, provided the target is bonded appropriately (indium or elastomer bonding available).
What bonding and backing plate options are available for this YbCoSb target to ensure thermal management during high-power sputtering?
The target offers optional indium bonding or elastomer bonding, with backing plate choices of oxygen-free copper or CuCrZr. These options are critical for heat dissipation at maximum DC power densities of 15 W/cm², preventing target cracking or delamination during extended deposition runs.
The YbCoSb alloy sputtering target offers 99.9% purity and optimized sputtering parameters for DC/RF magnetron deposition, but requires careful pre-order specification of bonding and backing plate options to match the user's system.
Positive
- High purity and low impurity levels: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Optimized sputtering performance: Designed for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Requires pre-order compatibility check: Buyers must confirm target purity, dimensions, composition ratio, and bonding requirements against their deposition system before ordering to ensure proper fit and performance.
- Optional bonding and backing plate selection: The target is supplied with optional indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate, requiring the user to specify the correct configuration for their sputtering system.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
