Vanadium-Tungsten Alloy Sputtering Target 99.9% ATOMFAIR®

$245.00

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Research-grade vanadium-tungsten sputtering target, 99.9% purity, VW 98/2 wt%, 1 in x 6 mm, for DC/RF magnetron sputtering and vacuum coating. Order now.

Vanadium-Tungsten Alloy Sputtering Target (VW (98/2 wt%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
Product Overview

Vanadium-Tungsten Alloy Sputtering Target (VW (98/2 wt%)) combines the VW (98/2 wt%) alloy composition with a source-listed purity of 99.9% and a target size of 1 indiameter x 6 mm.

The target is supplied for vacuum coating workflows using magnetron sputtering, vacuum plating and related deposition methods. Confirm the selected composition, dimensions, substrate system and quantity for the intended coating process.

Performance Features
  • VW (98/2 wt%) alloy with nominal composition per chemical formula, enabling stoichiometric transfer to deposited films within ±2 at% under optimized sputtering conditions.
  • 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm, minimizing contamination and improving deposited film resistivity and adhesion.
  • Optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar atmosphere, achieving deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
  • Suitable for diffusion barriers, gate electrodes and high-temperature protective coatings, with deposited films exhibiting adhesion strength >15 MPa (ASTM D4541 pull-off) on properly prepared substrates.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-MT-VW9S
Material / Formula VW (98/2 wt%)
Purity 99.9%
Target Size 1 indiameter x 6 mm
Relative Density ≥95% of theoretical
Grain Size ≤ 50 µm (fine-grained)
Deposition Method DC / RF Magnetron Sputtering
Max Power Density 3-15 W/cm² (DC) / 1-5 W/cm² (RF)
Bonding Type Indium bonding / Elastomer bonding (optional)
Backing Plate Oxygen-free copper / CuCrZr (optional)
Surface Finish Machined, Ra ≤ 0.8 µm
Thickness Tolerance ± 0.1 mm
Manufacturing Method Vacuum induction melting / Casting
Product Category Metal alloy sputtering target
PROCUREMENT CHECK: Confirm target specifications — purity, dimensions, composition ratio and bonding requirements — against your deposition system before ordering.
INQUIRY NOTE: Include the model number, target dimensions, purity grade and required quantity when requesting a quotation.
LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This document records the source-stated processing constraints for the Vanadium-Tungsten Alloy Sputtering Target (VW (98/2 wt%)). The constraints apply to magnetron sputtering parameter limits, bonding and backing integration, and substrate preparation.

  • Sputtering parameter window: Operate DC/RF magnetron sputtering only within the stated power density windows of 3-15 W/cm² (DC) or 1-5 W/cm² (RF).
  • Argon atmosphere: Maintain an argon process pressure of 0.5-2.0 Pa during deposition.
  • Bonding and backing integration: Confirm the selected bonding type and backing plate material are compatible with the deposition system before mounting.
  • Substrate preparation: Deposit only onto properly prepared substrates to attain the source-stated adhesion strength.
  • Pre-order specification confirmation: Confirm target purity, dimensions, composition ratio, and bonding requirements against the deposition system before ordering.

What deposition rate can be achieved with the VW (98/2 wt%) sputtering target under DC magnetron sputtering conditions?

Under optimized DC magnetron sputtering at 3–15 W/cm² power density and 0.5–2.0 Pa Ar atmosphere, the target achieves deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate.

What bonding and backing plate options are available for the VW target, and how do they affect compatibility with different sputtering systems?

The target offers optional indium bonding or elastomer bonding, and backing plate options of oxygen-free copper or CuCrZr. These options allow integration with various sputtering system configurations, but the user must confirm compatibility with their specific deposition system before ordering.

What pre-installation checks are critical before using this VW sputtering target in a vacuum deposition system?

The user must confirm the target purity (99.9%), dimensions (1" diameter x 6 mm), composition ratio (98/2 wt% VW), and bonding requirements against their deposition system's constraints. Any mismatch in size, bonding type, or backing plate can affect adhesion and deposition uniformity.

The Vanadium-Tungsten Alloy Sputtering Target (VW 98/2 wt%) with 99.9% purity and ≤50 µm grain size is engineered for DC/RF magnetron sputtering, delivering deposition rates of 10–80 nm/min and ±5% thickness uniformity on 100 mm substrates. Optimal stoichiometric transfer (±2 at%) requires precise control of power density and Ar pressure, and system compatibility must be verified prior to ordering.

Positive

  • High purity and low impurity levels: 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes film contamination and improves resistivity and adhesion.
  • Uniform deposition with controlled rate: Achieves deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate under specified DC/RF conditions.

Trade-offs

  • Stoichiometry sensitive to sputtering conditions: The specified ±2 at% stoichiometric transfer is only guaranteed under optimized sputtering parameters—deviation in power density or Ar pressure may alter film composition.
  • System compatibility must be verified: Procurement check advises confirming target composition, purity, dimensions, and bonding type against the specific deposition system to avoid operational mismatches.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).