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Vanadium-Aluminum Alloy Sputtering Target (VAl)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Vanadium-aluminum alloy sputtering target with 99.99% purity and 3-inch diameter. Requires precise power density, bonding, and substrate preparation to ensure optimal film deposition and prevent target damage.
- Power Density Limits: Operate DC magnetron sputtering between 3-15 W/cm² or RF sputtering between 1-5 W/cm² to avoid thermal stress and target cracking.
- Bonding and Backing Plate Compatibility: Select indium or elastomer bonding with an oxygen-free copper or CuCrZr backing plate to maintain thermal contact during sputtering.
- Argon Pressure Requirement: Maintain argon atmosphere between 0.5-2.0 Pa to sustain a stable magnetron plasma and achieve uniform deposition.
- Substrate Preparation: Prepare substrates to ensure adhesion strength exceeding 15 MPa as measured by ASTM D4541 pull-off testing.
- System Compatibility Verification: Confirm target dimensions, bonding type, and backing plate design match your sputtering gun and cooling system before installation.
What deposition rate and thickness uniformity can be achieved when sputtering a VAl alloy target under DC magnetron conditions?
Under DC sputtering at 3-15 W/cm² and 0.5-2.0 Pa Ar atmosphere, deposition rates of 10-80 nm/min are achievable with ±5% thickness uniformity across a 100 mm substrate. The fine grain size (≤50 µm) and high relative density (≥95%) support stable erosion and consistent film properties.
What composition tolerance is maintained during sputtering of the Vanadium-Aluminum alloy target?
The VAl target enables stoichiometric transfer to deposited films within ±2 at% under optimized sputtering conditions, as specified in the product's performance features. This tolerance is supported by the nominal alloy composition per chemical formula and the fine-grained microstructure.
What adhesion strength is specified for VAl films deposited using this target?
Deposited films exhibit adhesion strength >15 MPa as measured by ASTM D4541 pull-off testing on properly prepared substrates. The specification ensures robust interfacial bonding for functional thin-film applications, though substrate preparation procedures (e.g., cleaning, plasma etching) are critical to achieving this value.
This Vanadium-Aluminum Alloy Sputtering Target (VAl) offers 99.99% purity with low metallic and gaseous impurities, fine grain size (≤50 µm), and optimized sputtering parameters (DC/RF, 10-80 nm/min deposition rate, ±5% thickness uniformity) for functional thin-film deposition, but requires careful specification confirmation (composition, bonding, backing plate) and strict adherence to operating conditions (power density, Ar atmosphere).
Positive
- High purity with low impurities: 99.99% (4N) purity with total metallic impurities <100 ppm and O+N <20 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Controlled deposition uniformity: Optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates and adhesion >15 MPa (ASTM D4541).
Trade-offs
- Specification confirmation required: Purity, dimensions, composition ratio, bonding type, and backing plate must be confirmed against the deposition system before ordering to ensure compatibility and avoid process mismatch.
- Narrow operating parameter window: Optimal performance depends on strict adherence to power density ranges (DC 3-15 W/cm², RF 1-5 W/cm²) and Ar pressure (0.5-2.0 Pa); deviations may reduce deposition rate, uniformity, or film quality.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
