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Titanium-Magnesium Alloy Sputtering Target (TiMg(65:35 at%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document defines compatibility and processing constraints for the TiMg(65:35 at%) sputtering target. These constraints must be satisfied to avoid deposition process instability, bonding failure, or film contamination.
- Compatibility Verification: Confirm the TiMg 65:35 at% composition, target dimensions, bonding type, and backing plate match the deposition system before installation.
- Power Handling: Apply only DC or RF power densities within the manufacturer-stated operating ranges to prevent target overheating or process instability.
- Atmosphere Control: Maintain argon pressure within the manufacturer-stated sputtering range to sustain a stable plasma.
- Substrate Condition: Use cleaned, properly prepared substrates when the deposited film must achieve the stated adhesion strength.
- Surface Condition: Confirm the machined target surface finish meets the specified Ra ≤ 0.8 µm before mounting.
These steps describe pre-deposition verification, mounting, and process startup for the TiMg(65:35 at%) sputtering target. Perform the steps in sequence before initiating film deposition.
Required Equipment: DC/RF magnetron sputtering system, Vacuum chamber with argon gas supply, Sputter cathode assembly
- Confirm Target Specification
Confirm the TiMg 65:35 at% composition, dimensions, bonding type, and backing plate against the deposition system's requirements. - Mount Target Assembly
Mount the target assembly onto the magnetron cathode using the specified indium or elastomer bonding interface. - Position Prepared Substrates
Position cleaned, properly prepared substrates inside the vacuum chamber to receive the sputtered film. - Set Vacuum and Argon Pressure
Set the argon pressure within the manufacturer-stated sputtering range after pumping the chamber to vacuum. - Start Sputtering Deposition
Start deposition by applying DC or RF power within the manufacturer-stated density range and monitor the plasma for stability.
What are the recommended DC and RF sputtering power density ranges for the TiMg(65:35 at%) target to maintain stoichiometric film composition?
The target is optimized for DC magnetron sputtering at 3–15 W/cm² and RF sputtering at 1–5 W/cm² under 0.5–2.0 Pa Ar atmosphere. Under these conditions, deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate are achievable, and stoichiometric transfer within ±2 at% is maintained.
What bonding and backing plate options are available for the TiMg sputtering target, and how do they affect installation?
The target can be bonded with indium or elastomer bonding, and optionally mounted on an oxygen-free copper or CuCrZr backing plate. These options allow integration into different sputtering system configurations, with indium bonding providing superior thermal conductivity for high-power applications.
What are the typical applications and adhesion performance of TiMg alloy films deposited with this target?
Deposited TiMg films are suitable for biomedical implant coatings, diffusion barriers, and decorative films. Under optimized conditions, the films exhibit adhesion strength greater than 15 MPa when measured by ASTM D4541 pull-off testing on properly prepared substrates.
This TiMg(65:35 at%) sputtering target offers 99.9% purity and precise stoichiometric transfer for biomedical and diffusion barrier coatings, but requires careful system compatibility verification due to its fixed 75 mm diameter size and optional bonding/backing plate configurations.
Positive
- Precise stoichiometric transfer: TiMg(65:35 at%) composition enables stoichiometric transfer to deposited films within ±2 at% under optimized sputtering conditions, ensuring consistent film properties.
- High purity with low impurities: 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, improving deposited film resistivity and adhesion.
Trade-offs
- Fixed dimensions and composition: The target is supplied in a single size (75 mm diameter x 6 mm) and fixed TiMg(65:35 at%) composition. Buyers must confirm compatibility with their deposition system and desired film stoichiometry prior to ordering.
- Required bonding and backing plate selection: The target requires specification of bonding type (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) during procurement. Incorrect selection may affect thermal management and target mounting.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
