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Titanium-Chromium Alloy Sputtering Target (TiCr)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This TiCr sputtering target must be used in a compatible vacuum deposition system under the stated DC/RF magnetron sputtering conditions. Validate target composition, dimensions, bonding, and backing-plate configuration against the system before installation.
- Deposition environment requirement: Operate the target in an argon atmosphere at 0.5–2.0 Pa with DC or RF power densities within the stated ranges to maintain the intended sputtering behavior.
- Substrate preparation requirement: Prepare substrate surfaces properly before coating to achieve the reported film adhesion strength above 15 MPa when measured by ASTM D4541 pull-off testing.
- System compatibility check: Confirm the target purity, dimensions, composition ratio, and bonding requirements against the deposition system before ordering.
- Surface integrity requirement: Protect the machined target face from physical damage and contamination because the surface condition directly affects sputtering uniformity.
Verify all target specifications and system compatibility before mounting the TiCr sputtering target. Use the specified argon pressure and DC/RF power conditions to deposit films with predictable uniformity and adhesion.
Required Equipment: Magnetron sputtering deposition system, Argon gas supply, Substrate preparation tooling
- Confirm target specifications
Confirm the target purity, dimensions, composition ratio, and bonding requirements against the deposition system before ordering. - Verify coating configuration
Verify the selected composition, dimensions, substrate system, and quantity for the intended coating process. - Set deposition parameters
Set the argon pressure to 0.5–2.0 Pa and select the DC or RF power density within the stated range for the coating run. - Prepare substrate surfaces
Prepare the substrate surfaces appropriately before deposition to support the reported film adhesion strength above 15 MPa.
What is the typical deposition rate and thickness uniformity achievable with the TiCr alloy sputtering target under DC magnetron sputtering conditions?
Under optimized DC magnetron sputtering at 3-15 W/cm² in 0.5-2.0 Pa Ar atmosphere, the TiCr target achieves deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate. This ensures consistent film stoichiometry transfer within ±2 at% for high-performance coatings.
What type of bonding and backing plate options are available for integrating this TiCr sputtering target into existing vacuum deposition systems?
The TiCr target is available with indium bonding or elastomer bonding options, and with oxygen-free copper or CuCrZr backing plates (optional). These options allow compatibility with different sputtering system designs and thermal management requirements. The target size is 8 in diameter x 0.25 in, standard for many magnetron sources.
What are the purity and impurity specifications of the TiCr sputtering target, and what storage or handling considerations are recommended to maintain target integrity?
The target has a purity of 99.95% (3N5) with total metallic impurities <500 ppm and O+N <100 ppm, minimizing contamination risks. The target is delivered with machined surface finish Ra ≤ 0.8 µm and relative density ≥95% of theoretical. It should be stored in a dry, inert environment to prevent oxidation; handling with clean gloves is recommended to avoid surface contamination.
This TiCr sputtering target (99.95% purity, 8 in x 0.25 in) features fine grain size and high density for uniform deposition, but requires careful parameter control and selection of bonding/backing plate options for optimal performance.
Positive
- High purity with low impurities: Total metallic impurities <500 ppm and O+N <100 ppm minimize contamination in deposited films, improving resistivity and adhesion.
- Fine grain size and high density: Grain size ≤ 50 µm and relative density ≥95% of theoretical ensure uniform sputtering and consistent film properties.
Trade-offs
- Deposition parameter sensitivity: Optimal film uniformity (±5%) and stoichiometry (±2 at%) require precise control of power density (3-15 W/cm² DC, 1-5 W/cm² RF) and Ar pressure (0.5-2.0 Pa); deviation may degrade film quality.
- Optional bonding and backing plate compatibility: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate are optional; incorrect selection may cause thermal management issues or system incompatibility.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
