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Titanium-Cobalt Alloy Sputtering Target (TiCo (97:3 wt%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document records the installation and use constraints for the Atomfair AF-TI-TICS titanium-cobalt alloy sputtering target. It is limited to compatibility, sputtering environment, and pre-use verification requirements stated in the product listing.
- Deposition system compatibility: Confirm the selected composition, dimensions, substrate system, and quantity against the deposition system before ordering.
- Sputtering process environment: Operate the target only under DC or RF magnetron sputtering conditions with an argon process atmosphere within the stated power density range.
- Bonding and backing plate verification: Confirm whether indium or elastomer bonding and an oxygen-free copper or CuCrZr backing plate are required before installation.
- Pre-installation specification check: Verify target dimensions, thickness tolerance, surface finish, and bonding requirements before mounting to avoid process failure.
- Quotation specification record: Include the model number, target dimensions, purity grade, and required quantity when requesting a quotation.
What are the optimal DC and RF sputtering power density ranges for the TiCo (97:3 wt%) target to maintain stoichiometric transfer and deposition rate?
For DC magnetron sputtering, the recommended power density range is 3–15 W/cm²; for RF sputtering, it is 1–5 W/cm², both under an Ar atmosphere of 0.5–2.0 Pa. Within these conditions, deposition rates of 10–80 nm/min can be achieved with ±5% thickness uniformity across a 100 mm substrate, enabling stoichiometric transfer within ±2 at% of the target composition.
Which bonding and backing plate options are available for this TiCo alloy target, and how do they affect compatibility with different sputtering systems?
The target can be supplied with either indium bonding or elastomer bonding as optional bonding types, and the backing plate is available in oxygen-free copper or CuCrZr. These options allow the end user to match thermal and mechanical requirements of their specific deposition system; the correct combination should be confirmed with the system’s fixture and cooling constraints before ordering.
What are the purity and impurity specifications of the TiCo (97:3 wt%) target, and what implications do they have for film quality in sensitive applications?
The target is specified at 99.95% (3N5) purity with total metallic impurities below 500 ppm and combined oxygen and nitrogen impurities below 100 ppm. This high purity minimizes contamination in deposited films, which is critical for biomedical implant coatings, diffusion barriers, and decorative films where film resistivity, adhesion strength (>15 MPa per ASTM D4541), and compositional precision must be tightly controlled.
This TiCo (97:3 wt%) sputtering target offers 99.95% purity and fine-grained structure for stoichiometric film deposition, but requires careful matching of bonding and backing plate options to the sputtering system.
Positive
- High purity and controlled composition: 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm enables stoichiometric transfer within ±2 at% under optimized sputtering, minimizing contamination and improving film resistivity and adhesion.
- Optimized deposition parameters: Designed for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Parameter sensitivity requires precise control: Optimal film quality depends on maintaining power density and Ar pressure within stated ranges; deviations from 3-15 W/cm² (DC) or 1-5 W/cm² (RF) and 0.5-2.0 Pa may degrade stoichiometry or uniformity.
- Bonding and backing plate selection required: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate are optional but necessary for thermal management and system compatibility; improper selection risks target damage or deposition failure.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
