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Silver-Nickel Alloy Sputtering Target (AgNi (95:5 wt%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires precise matching of bonding type, backing plate material, and deposition parameters to the user's sputtering system. Deposited film quality depends on maintaining specified power density, argon pressure, and substrate preparation protocols.
- Bonding and Backing Plate Compatibility: Select indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate based on the sputtering cathode design and thermal management requirements.
- Deposition Parameter Limits: Operate DC magnetron sputtering at 3-15 W/cm² or RF at 1-5 W/cm² under 0.5-2.0 Pa argon atmosphere to achieve optimal deposition rates and film uniformity.
- Substrate Preparation Requirement: Prepare substrates to achieve adhesion strength exceeding 15 MPa as measured by ASTM D4541 pull-off testing.
- Purity and Contamination Control: Maintain handling and storage conditions that preserve the 99.9% purity and prevent introduction of metallic or gaseous impurities exceeding specified limits.
- Pre-Order Verification: Confirm target dimensions, composition ratio, and bonding requirements against the deposition system specifications before placing an order.
What deposition rate and thickness uniformity can I expect from the Atomfair AgNi (95:5) sputtering target under DC magnetron sputtering?
Under optimized DC/RF magnetron sputtering conditions (3–15 W/cm² DC, 0.5–2.0 Pa Ar atmosphere), the target achieves deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate. These specifications are directly listed for the AgNi (95:5 wt%) composition and are critical for stoichiometric film transfer within ±2 at%.
Does the Atomfair AgNi (95:5) sputtering target require a specific backing plate or bonding type?
The target is supplied with optional bonding types: indium bonding or elastomer bonding, and optional backing plates of oxygen-free copper or CuCrZr. Users must confirm bonding and backing plate requirements against their deposition system before ordering, as compatibility affects thermal management and film uniformity.
What are the purity and impurity limits of the Atomfair AgNi (95:5) sputtering target, and how do they affect film quality?
The target has a purity of 99.9% (3N) with total metallic impurities <1000 ppm and O+N <200 ppm. These stringent impurity limits minimize contamination in deposited films, improving resistivity consistency and adhesion strength exceeding 15 MPa (ASTM D4541) on properly prepared substrates.
The AgNi (95:5 wt%) sputtering target (SKU AF-NI-S-AGNI-9999-P98F) is a 99.9% purity metal alloy target with ≥95% relative density and ≤50 µm grain size, optimized for DC/RF magnetron sputtering under 0.5-2.0 Pa Ar to achieve stoichiometric film transfer within ±2 at% and adhesion >15 MPa.
Positive
- High purity and density: 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm, combined with ≥95% theoretical density, minimizes film contamination and supports consistent resistivity and adhesion in deposited coatings.
- Fine-grained microstructure: Grain size ≤50 µm and machined surface finish Ra ≤0.8 µm promote uniform sputter erosion and ±5% thickness uniformity across 100 mm substrates, reducing target conditioning time.
Trade-offs
- Narrow sputtering parameter window: Optimal deposition requires DC power density of 3-15 W/cm² or RF 1-5 W/cm² under 0.5-2.0 Pa Ar; deviations risk off-stoichiometry or reduced adhesion, demanding precise process control.
- Bonding and backing plate dependencies: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plates are optional but must be specified; incorrect selection may cause thermal mismatch or poor heat dissipation during high-power sputtering.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
