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Palladium-Nickel Alloy Sputtering Target (PdNi (90:10 At%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires operation within specified power density and argon pressure ranges to achieve stoichiometric film transfer and thickness uniformity. Bonding type and backing plate material must be selected to match the deposition system's thermal and mechanical requirements.
- Power Density Constraint: Operate DC magnetron sputtering at 3-15 W/cm² or RF at 1-5 W/cm² to maintain deposition rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates.
- Atmosphere Constraint: Maintain argon pressure between 0.5-2.0 Pa during sputtering to ensure stable plasma and film quality.
- Adhesion Constraint: Deposited films achieve adhesion strength greater than 15 MPa per ASTM D4541 on properly prepared substrates.
- Purity Constraint: Total metallic impurities below 500 ppm and oxygen plus nitrogen below 100 ppm minimize contamination in deposited films.
- Density and Grain Size Constraint: Relative density must be at least 95% of theoretical with grain size ≤50 µm to ensure uniform sputtering behavior.
How does the 99.95% purity level of this PdNi target influence the electrical resistivity and adhesion of sputtered films?
The 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes contamination, which improves deposited film resistivity and adhesion. Deposited films achieve adhesion strength >15 MPa (ASTM D4541) on properly prepared substrates, a direct result of the low impurity level.
What are the available bonding and backing plate configurations for this PdNi sputtering target?
The target supports optional indium bonding or elastomer bonding, and backing plates made of oxygen-free copper or CuCrZr. These options allow integration with various magnetron sputtering systems and thermal management requirements.
What manufacturing method and surface finish specifications ensure consistent sputtering performance of this PdNi target?
The target is manufactured by vacuum induction melting and casting, achieving a relative density ≥95% and fine grain size ≤50 µm. The surface is machined to Ra ≤0.8 µm, which promotes uniform erosion and reduces arcing during sputtering.
The PdNi (90:10 At%) sputtering target (SKU AF-NI-S-PDNI-9995-HQVF) offers a 99.95% purity alloy with fine grain size ≤50 µm and ≥95% relative density, enabling stoichiometric film transfer within ±2 at% under optimized DC/RF magnetron sputtering conditions. Operational constraints include a maximum power density of 15 W/cm² (DC) and 5 W/cm² (RF), requiring careful power management to avoid target cracking, and mandatory bonding selection (indium or elastomer) for thermal management in high-power applications.
Positive
- High-purity alloy with fine grain structure: 99.95% purity with total metallic impurities <500 ppm and O+N <100 ppm, combined with grain size ≤50 µm and ≥95% relative density, minimizes film contamination and supports uniform deposition with ±5% thickness uniformity across 100 mm substrates.
- Optimized for DC/RF magnetron sputtering: Operates at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar atmosphere, achieving deposition rates of 10-80 nm/min with adhesion strength >15 MPa (ASTM D4541 pull-off) on properly prepared substrates, suitable for electrode, contact, and catalytic coatings.
Trade-offs
- Power density limits require careful control: Maximum power density of 15 W/cm² (DC) and 5 W/cm² (RF) restricts high-rate deposition; exceeding these limits risks target cracking or thermal damage, necessitating precise power management and optional bonding (indium or elastomer) for heat dissipation.
- Bonding and backing plate selection mandatory: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate are optional but required for thermal and mechanical stability under sustained sputtering; improper selection may lead to delamination or reduced target lifetime.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
