|
Palladium-Yttrium Alloy Sputtering Target (PdY)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
|
|||||||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||||||
|
LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
|
|||||||||||||||||||||||||||||||||||||
|
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
|
This sputtering target requires precise control of deposition parameters to achieve stoichiometric transfer and film adhesion. Compatibility with the deposition system's bonding, backing plate, and power specifications must be verified prior to use.
- Deposition Parameter Constraints: Operate within 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar atmosphere to achieve 10-80 nm/min deposition rate with ±5% thickness uniformity.
- Film Adhesion Requirement: Deposited films must exhibit adhesion strength greater than 15 MPa per ASTM D4541 on properly prepared substrates.
- Bonding and Backing Plate Compatibility: Select indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate to match the deposition system's thermal and electrical requirements.
- Material Quality Constraints: Maintain relative density ≥93% of theoretical, grain size ≤50 µm, and total metallic impurities below 1000 ppm to minimize contamination.
- Procurement Verification: Confirm purity, dimensions, composition ratio, and bonding requirements against the deposition system before ordering.
What deposition rates and thickness uniformity can be expected from this PdY alloy sputtering target under optimized conditions?
Under optimized DC/RF magnetron sputtering at 3–15 W/cm² (DC) or 1–5 W/cm² (RF) in a 0.5–2.0 Pa Ar atmosphere, this PdY target achieves deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate, as stated in the product specifications.
How do the relative density and grain size of this PdY target affect sputtering performance?
The target's ≥93% relative density and ≤50 µm fine grain size reduce the risk of arcing and particle generation during sputtering, promoting more stable plasma conditions and improved film uniformity over the target's lifetime. These parameters are controlled by the vacuum arc melting manufacturing method.
What bonding and backing plate options are available for this PdY sputtering target, and how do they affect system integration?
Indium bonding or elastomer bonding are optionally available for thermal and mechanical interface to the cooling system, and the backing plate can be oxygen-free copper or CuCrZr. These options allow the target to be tailored to the specific thermal conductivity, adhesion, and mounting requirements of different magnetron sputtering systems.
The Palladium-Yttrium Alloy Sputtering Target (PdY) with 99.9% purity, fine-grained microstructure, and ≥93% relative density is engineered for DC/RF magnetron sputtering of magnetic, magneto-optical, and hydrogen-storage thin films, offering deposition rates of 10–80 nm/min with ±5% thickness uniformity across 100 mm substrates under optimized conditions.
Positive
- High purity with low contamination: The 99.9% (3N) purity, total metallic impurities <1000 ppm, and O+N <200 ppm minimize film contamination, improving resistivity and adhesion for advanced thin-film applications.
- Optimized sputtering performance: Designed for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates, enabling reproducible film growth.
Trade-offs
- Requires process optimization: Stoichiometric transfer is within ±2 at% only under optimized sputtering conditions, so users must calibrate power density, pressure, and substrate preparation to achieve target composition.
- Optional bonding and backing plate: Bonding type (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) are optional, requiring additional procurement decisions and compatibility checks with the sputtering system.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
