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Nickel-Titanium-Copper Alloy Sputtering Target (NiTiCu)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires precise control of deposition parameters to achieve stoichiometric transfer and film quality. Compatibility with the deposition system's bonding, backing plate, and substrate preparation must be verified prior to use.
- Power Density Limits: Operate DC sputtering at 3-15 W/cm² and RF sputtering at 1-5 W/cm² to avoid target damage or film degradation.
- Atmosphere Pressure: Maintain argon pressure between 0.5-2.0 Pa during sputtering to ensure stable plasma and deposition rate.
- Bonding and Backing Plate Selection: Select indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate compatible with the deposition system's thermal and mechanical requirements.
- Substrate Preparation: Prepare substrates to achieve adhesion strength exceeding 15 MPa per ASTM D4541 pull-off test.
- Purity Verification: Confirm total metallic impurities below 100 ppm and O+N below 20 ppm to minimize film contamination.
What deposition rate and thickness uniformity can be achieved with the NiTiCu alloy sputtering target under optimized DC magnetron sputtering conditions?
Under optimized DC magnetron sputtering at 3–15 W/cm² and 0.5–2.0 Pa Ar atmosphere, the NiTiCu target delivers deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate. The alloy composition transfers stoichiometrically within ±2 at% accuracy under these conditions.
What bonding and backing plate options are available for the NiTiCu target and how do they affect thermal management during sputtering?
The NiTiCu target offers optional indium bonding or elastomer bonding, with backing plate choices of oxygen-free copper or CuCrZr. Indium bonding provides superior thermal conductivity for high-power DC sputtering, while elastomer bonding may be chosen for lower thermal stress applications. The backing plate material also influences heat dissipation and target lifetime.
What are the specified purity and impurity levels of the NiTiCu target and how do they impact deposited film quality?
The target is specified at 99.99% (4N) purity with total metallic impurities <100 ppm and O+N <20 ppm. This high purity minimizes contamination in deposited films, improving resistivity control and adhesion strength (>15 MPa per ASTM D4541). The fine grain size (≤50 µm) also promotes uniform sputter erosion and consistent film properties.
The NiTiCu 99.99% sputtering target provides controlled stoichiometric transfer with ±2 at% composition accuracy and high adhesion strength >15 MPa, but requires careful optimization of sputtering parameters and substrate preparation to achieve these specifications.
Positive
- High purity with low impurities: 99.99% purity with total metallic impurities <100 ppm and O+N <20 ppm minimizes film contamination, improving resistivity and adhesion.
- Controlled stoichiometry and adhesion: Enables stoichiometric transfer within ±2 at% under optimized conditions and deposited films exhibit adhesion strength >15 MPa per ASTM D4541.
Trade-offs
- Requires optimized sputtering conditions: Stoichiometric transfer and adhesion performance depend on properly optimized sputtering parameters and substrate preparation; not guaranteed without process tuning.
- Must specify bonding and backing plate: Bonding type (indium or elastomer) and backing plate material must be selected for compatibility with the specific deposition system, requiring additional specification.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
