NiTi Alloy Sputtering Target 99.5% 4in x 5 mm ATOMFAIR®

$885.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade NiTi sputtering target, 99.5% purity, 4 in diameter x 5 mm, for DC/RF magnetron coating. In stock. Order now.

Nickel-Titanium Alloy Sputtering Target (NiTi)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
Product Overview

Nickel-Titanium Alloy Sputtering Target (NiTi) combines the NiTi alloy composition with a source-listed purity of 99.5% and a target size of 4 indiameter x 5 mm.

The target is supplied for vacuum coating workflows using magnetron sputtering, vacuum plating and related deposition methods. Confirm the selected composition, dimensions, substrate system and quantity for the intended coating process.

Performance Features
  • NiTi alloy with nominal composition per chemical formula, enabling stoichiometric transfer to deposited films within ±2 at% under optimized sputtering conditions.
  • 99.5% (2N5) purity with total metallic impurities <5000 ppm and O+N <1000 ppm, minimizing contamination and improving deposited film resistivity and adhesion.
  • Optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar atmosphere, achieving deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
  • Suitable for thin-film resistors, diffusion barriers and magnetic thin-film devices, with deposited films exhibiting adhesion strength >15 MPa (ASTM D4541 pull-off) on properly prepared substrates.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-NI-NITS
Material / Formula NiTi
Purity 99.5%
Target Size 4 indiameter x 5 mm
Relative Density ≥95% of theoretical
Grain Size ≤ 50 µm (fine-grained)
Deposition Method DC / RF Magnetron Sputtering
Max Power Density 3-15 W/cm² (DC) / 1-5 W/cm² (RF)
Bonding Type Indium bonding / Elastomer bonding (optional)
Backing Plate Oxygen-free copper / CuCrZr (optional)
Surface Finish Machined, Ra ≤ 0.8 µm
Thickness Tolerance ± 0.1 mm
Manufacturing Method Vacuum induction melting / Casting
Product Category Metal alloy sputtering target
PROCUREMENT CHECK: Confirm target specifications — purity, dimensions, composition ratio and bonding requirements — against your deposition system before ordering.
INQUIRY NOTE: Include the model number, target dimensions, purity grade and required quantity when requesting a quotation.
LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

This NiTi sputtering target is intended for vacuum deposition use only and must be operated within a compatible DC/RF magnetron sputtering system. Confirm all target specifications, bonding, and backing plate options against the deposition system before ordering or mounting.

  • Processing Environment: Use the target exclusively in vacuum coating workflows employing DC or RF magnetron sputtering.
  • Deposition System Compatibility: Verify that the selected bonding type and backing plate configuration match the requirements of the deposition system before use.
  • Procurement Verification: Confirm target purity, dimensions, composition ratio, and bonding requirements against the deposition system before ordering.
  • Substrate Preparation: Prepare substrates properly before deposition to achieve the stated film adhesion strength.

Confirm target compatibility with the intended vacuum deposition process before ordering or mounting. Verify all target specifications and configuration options against the deposition system.

Required Equipment: Magnetron sputtering system

  1. Confirm Target Specifications
    Confirm the selected target composition, dimensions, substrate system, and quantity match the intended coating process.
  2. Verify Bonding and Backing Plate
    Verify that the target bonding type and backing plate configuration are compatible with the deposition system before ordering.
  3. Request Quotation
    Include the model number, target dimensions, purity grade, and required quantity when submitting a quotation request.

What is the impact of the 99.5% purity (2N5) on the electrical resistivity of NiTi sputtered films?

The 99.5% purity with total metallic impurities <5000 ppm and O+N <1000 ppm minimizes contamination, which improves deposited film resistivity and adhesion. Under optimized sputtering conditions, stoichiometric transfer within ±2 at% is achievable, ensuring consistent film properties.

What are the optimal sputtering parameters for this NiTi target to achieve uniform film thickness?

The target is optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar atmosphere. Under these conditions, deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate are achievable.

What bonding and backing plate options are available for this NiTi sputtering target, and how do they affect thermal management?

The target offers optional indium bonding or elastomer bonding, with backing plate options of oxygen-free copper or CuCrZr. These options allow for effective thermal management during high-power sputtering, with maximum power densities of 3-15 W/cm² (DC) and 1-5 W/cm² (RF).

This NiTi sputtering target (99.5% purity, 4" diameter x 5 mm) is designed for DC/RF magnetron sputtering with controlled stoichiometric transfer and high film uniformity, but requires careful verification of deposition system compatibility and adherence to specified operating parameters.

Positive

  • High purity and stoichiometric control: The 99.5% (2N5) purity with total metallic impurities <5000 ppm and O+N <1000 ppm enables stoichiometric transfer within ±2 at% under optimized conditions, minimizing contamination and improving film resistivity and adhesion.
  • Optimized sputtering performance: Designed for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.

Trade-offs

  • Deposition system compatibility required: The target's 4-inch diameter and 5 mm thickness, along with optional indium/elastomer bonding and backing plate materials, must be verified against the specific sputter gun and cooling configuration before ordering.
  • Narrow operating parameter window: Optimal performance is constrained to DC/RF magnetron sputtering within a specific power density range (3-15 W/cm² DC or 1-5 W/cm² RF) and Ar atmosphere (0.5-2.0 Pa); deviations may reduce deposition rate, uniformity, or stoichiometry.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).