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Nickel-Niobium-Titanium Alloy Sputtering Target (NiNbTi)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires verification of compatibility with the deposition system including dimensions, bonding type, and backing plate. Optimal film quality depends on adherence to specified power density, argon pressure, and substrate preparation protocols.
- Deposition System Compatibility: Confirm that the target dimensions, bonding type, and backing plate match the requirements of your magnetron sputtering system before installation.
- Operating Parameter Limits: Operate the target within the specified DC power density of 3-15 W/cm² or RF power density of 1-5 W/cm² under an argon atmosphere of 0.5-2.0 Pa to maintain deposition rate and film uniformity.
- Substrate Preparation Requirement: Prepare substrates according to standard cleaning protocols to achieve deposited film adhesion strength greater than 15 MPa as measured by ASTM D4541 pull-off testing.
- Bonding and Backing Plate Selection: Select indium or elastomer bonding and an oxygen-free copper or CuCrZr backing plate based on thermal conductivity requirements and sputtering system compatibility.
What is the achievable deposition rate and thickness uniformity for a NiNbTi sputtering target under DC magnetron sputtering conditions?
Under optimized conditions, the NiNbTi alloy sputtering target achieves deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate when operated at 3–15 W/cm² DC power density in a 0.5–2.0 Pa Ar atmosphere.
What bonding and backing plate options are available for the NiNbTi sputtering target, and how do they affect system integration?
The target supports optional indium bonding or elastomer bonding, and backing plate options of oxygen-free copper or CuCrZr. Selection depends on thermal conductivity and mechanical compatibility with the deposition system; these options must be confirmed with the chamber specifications before ordering.
What are the specified purity and grain size of this NiNbTi target, and how do they influence deposited film quality?
The NiNbTi target is specified at 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm, minimizing contamination risks. The fine grain size of ≤50 µm ensures uniform sputtering erosion and consistent stoichiometric transfer to deposited films.
The NiNbTi sputtering target offers 99.9% purity, fine grain size ≤50 µm, and ≥97% theoretical density, enabling stoichiometric film transfer with adhesion >15 MPa for applications requiring diffusion barriers or high-temperature protective coatings.
Positive
- High purity with low impurities: 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Optimized sputtering performance and uniformity: Specified for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Requires optimized sputtering conditions: Optimal performance is constrained to specific power density ranges and Ar atmosphere pressures (0.5-2.0 Pa), limiting flexibility in non-standard deposition systems.
- System compatibility verification needed: Procurement check required to confirm target dimensions, bonding type, and backing plate against the specific sputtering system before ordering to ensure proper fit and operation.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
