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Nickel-Manganese Alloy Sputtering Target (NiMn(50:50at%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document states the operating, compatibility, and verification constraints for the NiMn(50:50at%) sputtering target. Apply these constraints when integrating the target into a deposition system and planning coating runs.
- Process atmosphere and pressure: Maintain the argon pressure between 0.5 and 2.0 Pa during DC or RF magnetron sputtering.
- Cathode power density range: Apply DC power densities of 3 to 15 W/cm² or RF power densities of 1 to 5 W/cm² without exceeding the stated range for the selected method.
- Bonding and backing plate compatibility: Confirm that the indium or elastomer bonding option and the oxygen-free copper or CuCrZr backing plate option are compatible with the deposition system.
- Pre-order specification verification: Verify the target purity, dimensions, composition ratio, and bonding requirements against the deposition system before ordering.
- Coating process confirmation: Confirm the selected composition, dimensions, substrate system, and quantity for the intended coating process.
What is the deposition rate and thickness uniformity achievable using the NiMn(50:50at%) sputtering target under DC magnetron sputtering?
Under DC magnetron sputtering at 3–15 W/cm² and 0.5–2.0 Pa Ar atmosphere, the NiMn(50:50at%) target yields deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate. These conditions enable stoichiometric transfer within ±2 at% of the 50:50 composition.
What bonding and backing plate options are available for the NiMn target, and how do they affect thermal management?
The target supports optional indium bonding or elastomer bonding and backing plates of oxygen-free copper or CuCrZr. Indium bonding provides high thermal conductivity for DC sputtering at higher power densities, while elastomer bonding allows easier target demounting. The choice directly impacts heat dissipation and target integrity during extended deposition runs.
How does the vacuum induction melting / casting manufacturing process influence the relative density and grain size of the NiMn target, and why are these parameters important?
Vacuum induction melting and casting produce a fine-grained microstructure with relative density ≥95% of theoretical and grain size ≤50 µm. High density minimizes voids and arcing during sputtering, while fine grain size promotes uniform erosion and stable film composition. Both features contribute to consistent thin-film properties and extended target lifetime.
The NiMn(50:50at%) sputtering target offers 99.95% purity with low oxygen and nitrogen impurities, enabling stoichiometric film deposition within ±2 at% under optimized DC/RF magnetron sputtering conditions, though bonding and backing plate options must be specified to match system requirements.
Positive
- High-purity alloy with low contaminants: 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Stoichiometric transfer within ±2 at%: The NiMn(50:50at%) composition enables precise stoichiometric transfer to deposited films under optimized sputtering conditions, critical for thin-film resistor and magnetic device applications.
Trade-offs
- Optimized sputtering conditions required: Achieving the stated ±2 at% stoichiometric transfer and ±5% thickness uniformity requires careful control of DC/RF power density, Ar pressure, and substrate preparation, increasing process setup complexity.
- Bonding and backing plate must be specified: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate are optional, requiring the buyer to select and confirm compatibility with their deposition system before ordering.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
