Nickel-Chromium Sputtering Target 99.5% NiCr ATOMFAIR®

$510.00

Institutional Procurement & Supply Compliance: As a verified US supplier, Atomfair accepts formal institutional Purchase Orders (POs), contract billing schedules, and custom procurement loops for university and national laboratories, and corporate R&D departments globally.

Research-grade NiCr sputtering target, 99.5% purity, custom size, AF-NI-NICS model. For DC/RF magnetron deposition and vacuum plating workflows.

Nickel-Chromium Alloy Sputtering Target (NiCr)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
Product Overview

Nickel-Chromium Alloy Sputtering Target (NiCr) combines the NiCr alloy composition with a source-listed purity of 99.5% and a target size of Custom.

The target is supplied for vacuum coating workflows using magnetron sputtering, vacuum plating and related deposition methods. Confirm the selected composition, dimensions, substrate system and quantity for the intended coating process.

Performance Features
  • NiCr alloy with nominal composition per chemical formula, enabling stoichiometric transfer to deposited films within ±2 at% under optimized sputtering conditions.
  • 99.5% (2N5) purity with total metallic impurities <5000 ppm and O+N <1000 ppm, minimizing contamination and improving deposited film resistivity and adhesion.
  • Optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar atmosphere, achieving deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
  • Suitable for thin-film resistors, diffusion barriers and magnetic thin-film devices, with deposited films exhibiting adhesion strength >15 MPa (ASTM D4541 pull-off) on properly prepared substrates.
Technical Specifications
Parameter Specification / Available Values
Atomfair Model AF-NI-NICS
Material / Formula NiCr
Purity 99.5%
Target Size Custom
Relative Density ≥95% of theoretical
Grain Size ≤ 50 µm (fine-grained)
Deposition Method DC / RF Magnetron Sputtering
Max Power Density 3-15 W/cm² (DC) / 1-5 W/cm² (RF)
Bonding Type Indium bonding / Elastomer bonding (optional)
Backing Plate Oxygen-free copper / CuCrZr (optional)
Surface Finish Machined, Ra ≤ 0.8 µm
Thickness Tolerance ± 0.1 mm
Manufacturing Method Vacuum induction melting / Casting
Product Category Metal alloy sputtering target
PROCUREMENT CHECK: Confirm target specifications — purity, dimensions, composition ratio and bonding requirements — against your deposition system before ordering.
INQUIRY NOTE: Include the model number, target dimensions, purity grade and required quantity when requesting a quotation.
LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
Manufacturer: Atomfair LLC
Brand: ATOMFAIR®

The NiCr sputtering target requires specific bonding and mounting procedures to ensure proper thermal and electrical contact during deposition. Operating parameters must be strictly controlled within the specified power density and pressure ranges to avoid target damage and ensure film uniformity.

  • Bonding and Backing Plate Selection: The target must be bonded to a compatible backing plate using indium or elastomer bonding to maintain thermal dissipation and electrical continuity during sputtering.
  • Power Density Limits: Apply DC power density between 3 and 15 W/cm² or RF power density between 1 and 5 W/cm² to prevent thermal stress, cracking, or delamination of the target.
  • Grain Size and Surface Finish: The fine-grained microstructure (≤50 µm) and machined surface finish (Ra ≤0.8 µm) are critical for achieving uniform erosion and low arcing during deposition.
  • Thickness and Density Tolerances: The target thickness tolerance of ±0.1 mm and relative density ≥95% of theoretical ensure consistent mounting and stable sputtering performance.
  • Substrate Preparation for Adhesion: Proper substrate cleaning and surface activation are required to achieve the specified adhesion strength greater than 15 MPa in deposited films.

What deposition rates and thickness uniformity can be expected from the NiCr (99.5%) sputtering target under DC magnetron conditions?

Under DC magnetron sputtering at 3–15 W/cm² and 0.5–2.0 Pa Ar atmosphere, deposition rates of 10–80 nm/min are achievable with ±5% thickness uniformity across a 100 mm substrate. The target's fine grain size ≤50 µm and relative density ≥95% support consistent erosion and film uniformity.

What bonding and backing plate options are available for this NiCr target to ensure thermal management in high-power sputtering?

Options include indium bonding or elastomer bonding, and backing plates of oxygen-free copper or CuCrZr. These choices affect thermal conductivity and mechanical stability; indium bonding on oxygen-free copper is typical for high-power DC sputtering up to 15 W/cm², while CuCrZr may be specified for improved strength in cycling applications.

What are the critical procurement considerations for integrating this custom-sized NiCr target into an existing sputtering system?

Confirm target specifications — purity 99.5%, composition NiCr, dimensions (custom), bonding type, and backing plate material — against your deposition system's cathode dimensions and cooling requirements. Also verify maximum power density limits (DC 3–15 W/cm², RF 1–5 W/cm²) to avoid target cracking or delamination during operation.

Atomfair NiCr sputtering target (99.5% purity, custom dimensions) provides high-purity films with controlled stoichiometry and adhesion, but requires pre-order specification of size, bonding, and backing plate, and operation within narrow power and pressure windows.

Positive

  • High purity and low contamination: 99.5% purity with total metallic impurities <5000 ppm and O+N <1000 ppm minimizes contamination in deposited films, improving resistivity and adhesion.
  • Optimized sputtering performance: Achieves deposition rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrate under DC/RF magnetron sputtering at specified power densities and Ar pressure.

Trade-offs

  • Custom dimensions require confirmation: The target is supplied in custom size; buyers must verify dimensions, purity, composition, and bonding requirements with the manufacturer before ordering to ensure compatibility with the deposition system.
  • Narrow operating parameter window: Optimal film quality is achieved only within DC power density 3-15 W/cm² or RF 1-5 W/cm² and Ar pressure 0.5-2.0 Pa; deviations may reduce deposition rate, uniformity, or stoichiometry.

Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.

To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.

Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).