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Nickel-Tungsten Alloy Sputtering Target (NiW (95/5at%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This research-grade metal alloy sputtering target is intended for vacuum coating workflows using magnetron sputtering, vacuum plating, and related deposition methods. Confirm the selected composition, dimensions, substrate system, and quantity against the intended coating process and verify all target specifications against the deposition system before ordering.
- Process compatibility confirmation: Confirm the selected composition, dimensions, substrate system, and quantity for the intended coating process.
- Pre-order specification verification: Verify the target purity, dimensions, composition ratio, and bonding requirements against the deposition system before ordering.
- Sputtering operating regime: Operate DC/RF magnetron sputtering within the stated power density and argon pressure ranges for this target.
- Bonding and backing plate compatibility: Select indium or elastomer bonding and an oxygen-free copper or CuCrZr backing plate only when compatible with the deposition system.
What is the composition tolerance of the NiW (95/5at%) sputtering target and how does it affect film stoichiometry?
Under optimized sputtering conditions, the NiW (95/5at%) target enables stoichiometric transfer to deposited films within ±2 at% of the nominal composition. This tolerance is achieved through the specified 99.9% purity and fine-grained microstructure (≤50 µm), which minimize contamination and promote uniform erosion. The ±2 at% control is critical for applications like thin-film resistors and diffusion barriers where precise alloy ratios directly influence electrical and mechanical properties.
What are the optimal sputtering parameters for the NiW (95/5at%) target to achieve uniform deposition?
For DC magnetron sputtering, the recommended power density range is 3-15 W/cm², while RF sputtering operates at 1-5 W/cm², both under an Ar atmosphere of 0.5-2.0 Pa. Under these conditions, deposition rates of 10-80 nm/min are achievable with ±5% thickness uniformity across a 100 mm substrate. These parameters ensure controlled film growth and are specified for the 2-inch diameter by 0.125-inch thick target.
What manufacturing method is used for the NiW sputtering target and how does it influence density and grain size?
The target is manufactured by vacuum induction melting and casting, which yields a relative density of ≥95% of theoretical and a fine-grained microstructure with grain size ≤50 µm. The combination of high density and fine grain size reduces particle ejection during sputtering and improves film uniformity. These specifications are critical for reliable operation in DC/RF magnetron sputtering systems.
The Nickel-Tungsten Alloy Sputtering Target (NiW 95/5at%) offers high-purity (99.9%) and fine-grained microstructure for reliable thin-film deposition, but requires precise sputtering conditions and compatibility checks for system integration.
Positive
- High Purity and Composition Control: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm, combined with composition accuracy of ±2 at% under optimized sputtering, minimizes contamination and ensures stoichiometric film transfer.
- Optimized Sputtering Performance: DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar yields deposition rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates, suitable for thin-film resistors and diffusion barriers.
Trade-offs
- Specific Operating Conditions Required: Achieving specified deposition rates and uniformity requires precise control of power density, pressure, and substrate preparation; deviations may degrade film quality.
- Fixed Target Geometry and Bonding Options: The target is only available in 2-inch diameter x 0.125-inch thickness with optional indium or elastomer bonding, which may not be compatible with all deposition systems or thermal management requirements.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
