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Nickel-Niobium-Tantalum Alloy Sputtering Target (NiNbTa (60/30/10 at%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires precise control of deposition parameters to achieve stoichiometric transfer and film adhesion. The target must be mounted with appropriate bonding and backing plate for thermal management during sputtering.
- Sputtering Parameter Constraints: Operate the target within DC power density of 3-15 W/cm² or RF power density of 1-5 W/cm² under an argon atmosphere of 0.5-2.0 Pa to maintain deposition rate and uniformity.
- Substrate Preparation Requirement: Prepare substrates according to ASTM D4541 standards to achieve deposited film adhesion strength exceeding 15 MPa.
- Bonding and Backing Plate Constraints: Select indium or elastomer bonding with an oxygen-free copper or CuCrZr backing plate to ensure adequate thermal dissipation during sputtering.
- Microstructural Constraints: Maintain grain size at or below 50 µm and relative density at or above 97% of theoretical to minimize porosity and ensure uniform sputtering.
What deposition rate and thickness uniformity can be expected from the NiNbTa (60/30/10 at%) sputtering target under optimized DC magnetron sputtering conditions?
Under optimized DC magnetron sputtering at power densities of 3–15 W/cm² and an Ar atmosphere of 0.5–2.0 Pa, the NiNbTa target achieves deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate. These specifications are based on the product's performance features and technical parameters.
What bonding and backing plate configurations are available for the NiNbTa sputtering target, and how do they affect system integration?
The NiNbTa target is available with optional Indium bonding or Elastomer bonding, and backing plate options of oxygen-free copper or CuCrZr. These configurations allow the target to be tailored to specific sputtering system thermal management and mechanical mounting requirements, as detailed in the technical specifications.
What purity and impurity levels does the NiNbTa (60/30/10 at%) sputtering target meet, and how do they influence film quality in protective coating applications?
The target meets 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm, minimizing contamination. This high purity level is critical for achieving low resistivity, strong adhesion (>15 MPa per ASTM D4541), and reliable performance in diffusion barriers, gate electrodes, and high-temperature protective coatings as specified in the product description.
This NiNbTa (60/30/10 at%) sputtering target offers 99.9% purity and fine-grained microstructure for stoichiometric film deposition, but requires careful specification of bonding and backing plate options and optimized sputtering conditions to achieve the stated performance.
Positive
- Precise stoichiometric composition control: NiNbTa (60/30/10 at%) alloy transfers stoichiometry to deposited films within ±2 at% under optimized sputtering conditions, enabling reliable film composition.
- High purity with low contamination: 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, improving film resistivity and adhesion.
Trade-offs
- Requires bonding and backing plate specification: Bonding type (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) are optional but must be specified to ensure compatibility with the sputtering system; otherwise the target may not be ready for use.
- Deposition performance depends on optimized conditions: Stated deposition rates of 10-80 nm/min and ±5% thickness uniformity are only achieved under optimized DC/RF power and Ar pressure ranges, requiring careful process control.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
