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Nickel-Molybdenum-Tungsten Alloy Sputtering Target (NiMoW (84/8/8 wt%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires controlled DC or RF magnetron sputtering within specified power density and argon pressure ranges to achieve stoichiometric film transfer. The target material demands proper bonding and backing plate selection to manage thermal load during deposition.
- Power density limits: Operate the target at DC power densities of 3-15 W/cm² or RF power densities of 1-5 W/cm² to avoid overheating or damage.
- Atmosphere requirements: Maintain an argon atmosphere between 0.5 and 2.0 Pa during sputtering to sustain stable plasma and deposition conditions.
- Bonding and backing plate: Select indium bonding or elastomer bonding with an oxygen-free copper or CuCrZr backing plate to ensure adequate thermal conductivity and adhesion.
- Surface preparation: Machine the target surface to a roughness average of ≤0.8 µm to minimize arcing and promote uniform film growth.
- Grain size and density: Use targets with a grain size ≤50 µm and relative density ≥97% of theoretical to reduce particle generation and improve film uniformity.
How does the ±2 at% composition tolerance of the NiMoW (84/8/8 wt%) sputtering target affect the stoichiometry and electrical properties of deposited films?
The target is designed to transfer stoichiometry to deposited films within ±2 at% under optimized sputtering conditions. This tolerance ensures that the deposited film closely matches the target composition, which is critical for achieving consistent diffusion barrier performance or gate electrode resistivity. The 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm further minimizes contamination, improving film adhesion and resistivity.
What backing plate and bonding options are available for the NiMoW sputtering target, and how do they affect compatibility with different magnetron sputtering systems?
The target is available with optional indium bonding or elastomer bonding, and backing plates of oxygen-free copper or CuCrZr. These options allow integration into various sputtering systems that require specific thermal conductivity or mechanical mounting. The standard surface finish is machined to Ra ≤ 0.8 µm, and thickness tolerance is ±0.1 mm, ensuring proper fit.
How does the choice of indium bonding versus elastomer bonding affect the thermal management and operational lifetime of the NiMoW sputtering target?
Indium bonding offers superior thermal conductivity for high-power DC sputtering, while elastomer bonding provides easier target exchange and lower risk of thermal stress. The target is rated for max power density of 3–15 W/cm² (DC) or 1–5 W/cm² (RF), and the backing plate material (oxygen-free copper or CuCrZr) further influences heat dissipation and operational lifetime.
This NiMoW (84/8/8 wt%) sputtering target offers 99.9% purity, ≥97% relative density, and ≤50 µm grain size, enabling high-quality film deposition with adhesion >15 MPa and ±5% thickness uniformity across 100 mm substrates under DC/RF magnetron sputtering conditions.
Positive
- High purity and fine microstructure: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm, relative density ≥97%, and grain size ≤50 µm minimize film contamination and improve resistivity and adhesion.
- Broad sputtering process window: Optimized for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving deposition rates of 10-80 nm/min with ±5% thickness uniformity over 100 mm substrates.
Trade-offs
- Stoichiometric transfer depends on optimization: The ±2 at% composition transfer is only guaranteed under optimized sputtering conditions; deviations may occur if power density, pressure, or substrate temperature are not carefully controlled.
- Compatibility verification required before ordering: Bonding type (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) are optional; buyers must confirm these specifications against their deposition system to avoid fitment or thermal issues.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
