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Nickel-Aluminum Alloy Sputtering Target (Ni:Al ( 50:50 at%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires precise control of power density and argon pressure to achieve stoichiometric film transfer. Bonding type and backing plate material must be selected to match the deposition system's thermal and mechanical requirements.
- Sputtering Parameter Constraints: Operate within 3-15 W/cm² DC or 1-5 W/cm² RF power density under 0.5-2.0 Pa argon atmosphere to maintain deposition rate and film uniformity.
- Bonding and Backing Plate Compatibility: Select indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate based on the sputtering system's cooling and mounting configuration.
- Substrate Preparation Requirement: Prepare substrates to achieve adhesion strength exceeding 15 MPa per ASTM D4541 pull-off test.
- Surface Finish and Dimensional Tolerance: Confirm that the target surface finish (Ra ≤ 0.8 µm) and thickness tolerance (±0.1 mm) are compatible with the deposition chamber's clamping and alignment.
- Pre-Order Specification Verification: Verify purity, dimensions, composition ratio, and bonding requirements against the deposition system before placing an order.
What deposition rate and thickness uniformity can be expected from the Ni:Al (50:50 at%) sputtering target under DC magnetron sputtering?
Under DC magnetron sputtering at 3-15 W/cm² and 0.5-2.0 Pa Ar, this target achieves deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate. The stoichiometric transfer is maintained within ±2 at% of the nominal 50:50 composition under optimized conditions.
What bonding and backing plate options are available for the Ni:Al (50:50 at%) sputtering target, and how do they affect thermal management?
The target supports indium bonding or elastomer bonding as optional bonding types, with backing plate options of oxygen-free copper or CuCrZr. Indium bonding provides superior thermal conductivity for high-power DC sputtering up to 15 W/cm², while elastomer bonding offers easier demounting for RF applications up to 5 W/cm².
What are the specified purity and impurity levels of this Ni:Al (50:50 at%) sputtering target, and how do they affect film adhesion?
The target is 99.95% (3N5) pure with total metallic impurities <500 ppm and O+N <100 ppm. This high purity minimizes contamination that could degrade resistivity or adhesion; deposited films exhibit adhesion strength >15 MPa (ASTM D4541 pull-off) on properly prepared substrates.
The Ni:Al (50:50 at%) sputtering target delivers 99.95% purity with controlled stoichiometry and optimized DC/RF magnetron sputtering parameters for uniform thin-film deposition in resistors and diffusion barriers, but bonding and backing plate options require system-specific validation before procurement.
Positive
- High purity with low contamination: 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes film contamination, improving resistivity and adhesion for precision thin-film applications.
- Optimized sputtering parameters: Designed for DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Bonding and backing plate options: Requires optional indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate, adding procurement complexity and potential compatibility issues with existing sputtering systems.
- Procurement check necessary: Buyers must confirm target specifications (purity, dimensions, composition ratio, bonding) against their deposition system before ordering, as improper matching can compromise performance.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
