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Lanthanum-Yttrium Alloy Sputtering Target (LaY)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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Store the target in a dry, inert atmosphere to prevent surface oxidation and moisture adsorption. Handle with clean, powder-free gloves to avoid contamination that can degrade film adhesion and purity.
- Environmental Sensitivity: Exposure to ambient humidity or oxygen can form surface oxides that reduce sputtering yield and film stoichiometry.
- Contamination Risk: Fingerprints or organic residues on the target surface introduce impurities that increase film resistivity and compromise adhesion strength.
- Mechanical Integrity: The fine-grained microstructure (≤50 µm) and relative density ≥93% require careful mounting to avoid cracking under thermal stress during high-power sputtering.
This procedure covers mounting, bonding verification, and pre-sputter conditioning for a LaY alloy target in a magnetron sputtering system. Proper execution ensures stable deposition rates and film uniformity.
Required Equipment: DC/RF magnetron sputtering system with compatible cathode, Inert gas supply (Ar, 99.999% purity), Cleanroom-grade powder-free gloves
- Inspect target surface
Inspect the target surface for visible oxidation, scratches, or contamination before mounting. - Mount target onto backing plate
Mount the target onto the backing plate using the specified bonding method (indium or elastomer) to ensure thermal contact and mechanical stability. - Install assembly in vacuum chamber
Install the bonded target assembly into the sputtering cathode and evacuate the chamber to base pressure below 1×10⁻⁴ Pa. - Set sputtering parameters
Set the Ar working pressure to 0.5–2.0 Pa and apply DC power at 3–15 W/cm² or RF power at 1–5 W/cm². - Pre-sputter to remove surface layer
Pre-sputter the target for 10–15 minutes with the shutter closed to remove any oxidized surface layer and stabilize the plasma. - Verify deposition rate
Verify the deposition rate (10–80 nm/min) using a quartz crystal microbalance before opening the shutter to the substrate.
What deposition rate and thickness uniformity can be expected when sputtering a LaY alloy target under DC vs. RF magnetron conditions?
Under DC magnetron sputtering at 3–15 W/cm², the LaY target yields deposition rates of 10–80 nm/min with ±5% thickness uniformity across a 100 mm substrate. Under RF sputtering at 1–5 W/cm², the rates fall within the same range but require lower power density due to insulating surface effects. The 99.95% purity and fine grain size (≤50 µm) help maintain consistent stoichiometric transfer (within ±2 at%) across both modes.
What are the critical compatibility constraints when using LaY sputtering targets for hydrogen-storage thin film deposition?
The deposited films must exhibit adhesion strength >15 MPa per ASTM D4541 on properly prepared substrates, which requires clean, oxide-free surfaces. The source specifies total metallic impurities <500 ppm and O+N <100 ppm to minimize contamination that can degrade hydrogen-storage performance. Additionally, the target composition should be verified against the deposition system to ensure the intended stoichiometry for hydrogen absorption-desorption behavior.
What bonding and backing plate options are recommended for LaY alloy sputtering targets to ensure thermal management and target integrity during high-power sputtering?
Atomfair offers indium bonding or elastomer bonding as optional bonding layers, and backing plates of oxygen-free copper or CuCrZr. These choices help dissipate heat from the LaY target (relative density ≥93%, grain size ≤50 µm) during DC sputtering up to 15 W/cm² or RF sputtering up to 5 W/cm². Proper bonding and backing selection reduce thermal stress and prevent target cracking, especially for rare-earth alloy targets with moderate thermal conductivity.
The LaY alloy sputtering target (99.95% purity, 3 in diameter x 0.125 in thick) is engineered for DC/RF magnetron sputtering of magnetic, magneto-optical, and hydrogen-storage thin films, with a fine-grained microstructure (≤50 µm) and ≥93% relative density to support stoichiometric transfer and adhesion >15 MPa.
Positive
- High-purity LaY alloy composition: 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes film contamination, supporting consistent resistivity and adhesion in deposited layers.
- Optimized sputtering performance: Operates at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates, suitable for reproducible thin-film fabrication.
Trade-offs
- Bonding and backing plate options: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plates are optional, requiring the buyer to specify and confirm compatibility with their sputtering system to avoid thermal or mechanical mismatch.
- Composition and dimension verification: The target's nominal LaY composition and 3 in x 0.125 in size must be confirmed against the deposition system's target holder and process requirements, as off-spec dimensions or ratio can affect film stoichiometry and system fit.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
