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Gold-Germanium-Nickel Alloy Sputtering Target (AuGeNi)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This document specifies the deposition and handling constraints for the ATOMFAIR AuGeNi alloy sputtering target. Operators must confirm target specifications and deposition parameters against their deposition system before ordering.
- Sputtering atmosphere and pressure window: Operate the target under an argon atmosphere of 0.5-2.0 Pa for magnetron sputtering.
- DC/RF power density limits: Limit applied power density to 3-15 W/cm² for DC sputtering and 1-5 W/cm² for RF sputtering.
- Bonding and backing plate compatibility: Select indium or elastomer bonding and an oxygen-free copper or CuCrZr backing plate according to the deposition system's mounting and cooling requirements.
- Substrate preparation requirement: Prepare substrates properly before coating to achieve the stated deposited film adhesion strength.
- Pre-order system compatibility verification: Confirm target purity, dimensions, composition ratio, and bonding requirements against the deposition system before ordering or installation.
What thickness uniformity can be expected when sputtering the 2-inch diameter AuGeNi target on a 100 mm substrate?
The target achieves ±5% thickness uniformity across a 100 mm substrate under optimized DC/RF magnetron sputtering conditions. Deposition rates range from 10 to 80 nm/min depending on power density and pressure within the recommended 0.5-2.0 Pa Ar atmosphere.
What manufacturing process and microstructural specifications are specified for the AuGeNi sputtering target?
The AuGeNi target is manufactured using vacuum induction melting and casting, ensuring a relative density ≥95% of theoretical value and a fine-grained microstructure with grain size ≤50 µm. These specifications contribute to uniform sputtering erosion and consistent film composition.
What are the maximum permissible power densities for DC and RF sputtering of the AuGeNi target to avoid damage or degradation?
The recommended power density range is 3-15 W/cm² for DC magnetron sputtering and 1-5 W/cm² for RF sputtering. Exceeding these limits can cause target cracking, delamination from the backing plate, or uncontrolled compositional shifts. The target's fine-grained microstructure (≤50 µm) and high density (≥95% theoretical) support stable operation within these parameters.
The AuGeNi sputtering target (99.9% purity, 2 in diameter x 0.125 in) is engineered for DC/RF magnetron sputtering with optimized deposition rates of 10-80 nm/min and ±5% thickness uniformity, offering low impurity levels (<1000 ppm metallic, <200 ppm O+N) for reliable electrode and contact coatings.
Positive
- High purity with low impurities: 99.9% (3N) purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination, improving deposited film resistivity and adhesion.
- Optimized deposition performance: Supports DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar, achieving 10-80 nm/min deposition rates with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Requires optimized sputtering conditions: Stoichiometric transfer of AuGeNi composition to deposited films is within ±2 at% only under optimized sputtering parameters, demanding careful process calibration.
- Handling and compatibility constraints: Target surface finish (Ra ≤ 0.8 µm) and optional bonding types (indium or elastomer) require careful handling and verification of compatibility with the deposition system's cooling and clamping mechanisms.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
