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Iron-Silicon Alloy Sputtering Target (FeSi)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires controlled DC/RF magnetron sputtering within specified power density and argon pressure ranges to achieve stoichiometric film transfer and adhesion. Proper bonding selection (indium or elastomer) and backing plate material (oxygen-free copper or CuCrZr) are necessary for thermal management and system compatibility.
- Sputtering Parameters: Operate the target at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar atmosphere to achieve deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
- Bonding and Backing Plate: Select indium bonding or elastomer bonding with an oxygen-free copper or CuCrZr backing plate to ensure thermal conductivity and mechanical stability during sputtering.
- Substrate Preparation: Prepare substrates to achieve adhesion strength greater than 15 MPa as measured by ASTM D4541 pull-off test.
- Purity and Contamination Control: Maintain total metallic impurities below 1000 ppm and oxygen plus nitrogen below 200 ppm to minimize film contamination.
- Grain Size and Surface Finish: Ensure the target has a fine-grained structure (≤50 µm) and machined surface finish (Ra ≤0.8 µm) for uniform sputter erosion.
How does the fine grain size (≤50 µm) and high relative density (≥95%) of the FeSi sputtering target influence deposition rate and film uniformity?
The fine grain size and high density minimize arcing and particle generation, enabling stable sputtering at rates of 10–80 nm/min with ±5% thickness uniformity across 100 mm substrates under DC/RF magnetron sputtering. This ensures consistent stoichiometric transfer within ±2 at% under optimized conditions.
What bonding and backing plate configurations are recommended for the FeSi target in high-power DC sputtering applications?
For DC sputtering up to 15 W/cm², Indium bonding to an oxygen-free copper backing plate is recommended for optimal thermal conductivity. For RF sputtering up to 5 W/cm², elastomer bonding or CuCrZr backing plates are optional alternatives that reduce thermal stress. Confirm compatibility with your deposition system before ordering.
What storage and handling precautions are required to preserve the surface finish (Ra ≤0.8 µm) and purity (99.9%) of the FeSi sputtering target?
Store the target in a vacuum-sealed or inert gas environment to prevent oxidation and contamination. Handle using clean, powder-free gloves to avoid introducing impurities that could degrade film adhesion (>15 MPa per ASTM D4541) or increase metallic impurities (kept below 1000 ppm). Avoid exposure to moisture.
The FeSi alloy sputtering target (99.9% purity, 2 in diameter x 0.125 in) offers controlled stoichiometric transfer and high adhesion strength for soft magnetic thin films, but requires careful system compatibility verification and adherence to specified sputtering parameters.
Positive
- High purity and low impurity levels: 99.9% purity with total metallic impurities <1000 ppm and O+N <200 ppm minimizes contamination in deposited films, improving resistivity and adhesion.
- Optimized sputtering performance: DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar yields deposition rates of 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Requires deposition system compatibility check: Procurement must confirm target specifications (purity, dimensions, composition ratio, bonding requirements) against the deposition system before ordering to ensure fit.
- Specific operating parameter constraints: Optimal performance is limited to DC/RF magnetron sputtering within defined power density and pressure ranges; deviations may affect deposition rate and film quality.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
