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Iron-Nickel Alloy Sputtering Target (FeNi)
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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The FeNi sputtering target must be used in a vacuum deposition system with DC or RF magnetron sputtering, requiring precise control of power density and argon pressure to achieve stoichiometric film transfer and adhesion. Proper selection of bonding type and backing plate material is necessary to ensure thermal management and prevent target cracking or delamination during operation.
- Power Density Range: Operate within 3-15 W/cm² for DC or 1-5 W/cm² for RF sputtering to avoid target overheating or reduced film quality.
- Argon Pressure Range: Maintain argon pressure between 0.5-2.0 Pa to sustain stable plasma and achieve uniform deposition rates.
- Substrate Preparation Requirement: Substrates must be properly cleaned and prepared to achieve deposited film adhesion strength greater than 15 MPa per ASTM D4541 pull-off test.
- Bonding and Backing Plate Compatibility: Select indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate based on thermal load and system compatibility to prevent target failure.
What deposition rate and thickness uniformity can be expected from the Atomfair FeNi sputtering target under standard DC magnetron sputtering conditions?
Under optimized DC magnetron sputtering at 3-15 W/cm² and 0.5-2.0 Pa Ar, the FeNi target achieves deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate. The film composition is within ±2 at% of the nominal FeNi ratio.
Which bonding and backing plate configurations are available for the FeNi sputtering target, and how do they influence system compatibility?
The FeNi target is available with indium bonding or elastomer bonding, and can be mounted on oxygen-free copper or CuCrZr backing plates. The choice of bonding affects thermal conductivity and may require specific clamping mechanisms in your sputtering system. Confirm compatibility with your system's cooling and mounting design before ordering.
What is the surface finish specification of the FeNi sputtering target and why is it important for deposition quality?
The target has a machined surface finish with Ra ≤ 0.8 µm. This fine surface finish ensures uniform sputtering erosion, minimizes particle generation, and reduces the risk of arcing during deposition, all of which are critical for maintaining high film purity and consistent performance.
The FeNi alloy sputtering target (99.95% purity, 2 in diameter × 0.125 in thickness) is designed for DC/RF magnetron sputtering, delivering stoichiometric FeNi films with ≤500 ppm total metallic impurities and ±5% thickness uniformity across 100 mm substrates for soft magnetic and sensor thin-film applications.
Positive
- High purity with low metallics: 99.95% (3N5) purity with total metallic impurities <500 ppm and O+N <100 ppm minimizes contamination, improving deposited film resistivity and adhesion for sensitive soft magnetic and sensor layers.
- Fine-grained dense microstructure: Relative density ≥95% of theoretical and grain size ≤50 µm reduce nodule formation and arcing during sputtering, supporting consistent deposition rates of 10–80 nm/min with ±5% thickness uniformity.
Trade-offs
- Bonding and backing plate dependencies: Optional indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate must be specified before ordering, as improper selection may cause thermal mismatch or poor heat dissipation under high power densities.
- Requires vacuum infrastructure and calibration: Optimal performance (stoichiometry within ±2 at%, adhesion >15 MPa) depends on use with DC/RF magnetron sputtering systems at 0.5–2.0 Pa Ar and power density within 3–15 W/cm² (DC) or 1–5 W/cm² (RF), necessitating validated vacuum and power control equipment.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
