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Copper-Nickel Alloy Sputtering Target (CuNi (55:45 wt%))
Product Type: Metal alloy sputtering target
Research-grade laboratory product
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LABORATORY PROCUREMENT SUPPORT
INQUIRY: inquiry@atomfair.com
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Manufacturer: Atomfair LLC
Brand: ATOMFAIR®
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This sputtering target requires vacuum deposition equipment with Ar atmosphere, controlled power density, and compatible bonding and backing plate options. Its fine-grained microstructure and surface finish demand careful handling to avoid contamination and ensure uniform erosion.
- Operating Atmosphere and Power Density: The target must be sputtered under 0.5-2.0 Pa Ar atmosphere with DC power density of 3-15 W/cm² or RF power density of 1-5 W/cm².
- Bonding and Backing Plate Compatibility: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate must be selected to match the sputtering system's thermal and mechanical interface.
- Dimensional Verification: Target dimensions and thickness tolerance (±0.1 mm) must be verified against the cathode and clamping mechanism to ensure proper fit.
- Surface and Microstructure Integrity: The fine-grained (≤50 µm) structure and machined surface finish (Ra≤0.8 µm) must be maintained to prevent arcing and promote uniform erosion.
- Contamination Prevention: Deposited film adhesion (>15 MPa) requires clean substrate preparation; target surface must be kept free of contamination during handling and installation.
Can the CuNi (55:45 wt%) sputtering target maintain stoichiometric composition in deposited films?
Yes, under optimized sputtering conditions the target achieves stoichiometric transfer within ±2 at% of the 55:45 wt% ratio. This is facilitated by the fine grain size (≤50 µm) and high relative density (≥95% of theoretical) which promote uniform erosion.
What are the recommended sputtering parameters for this CuNi alloy target?
The target is optimized for DC or RF magnetron sputtering at power densities of 3-15 W/cm² (DC) or 1-5 W/cm² (RF), under 0.5-2.0 Pa Ar atmosphere. These conditions yield deposition rates of 10-80 nm/min with ±5% thickness uniformity across a 100 mm substrate.
What purity and impurity levels does the 99.99% CuNi target provide?
The target has a purity of 99.99% (4N) with total metallic impurities <100 ppm and oxygen+nitrogen <20 ppm. This high purity minimizes contamination in deposited films, improving resistivity and adhesion performance.
This CuNi (55:45 wt%) sputtering target delivers 99.99% purity and fine-grained microstructure for low-contamination films with reliable adhesion, but bonding and backing plate options must be matched to the deposition system, and sputtering parameters require tight control for optimal uniformity.
Positive
- High purity and low impurity levels: 99.99% purity with total metallic impurities <100 ppm and O+N <20 ppm minimizes contamination, improving film resistivity and adhesion.
- Optimized deposition parameters: DC/RF magnetron sputtering at 3-15 W/cm² (DC) or 1-5 W/cm² (RF) under 0.5-2.0 Pa Ar achieves 10-80 nm/min with ±5% thickness uniformity across 100 mm substrates.
Trade-offs
- Bonding and backing plate compatibility: Indium or elastomer bonding and oxygen-free copper or CuCrZr backing plate options require careful selection to match thermal management and deposition system constraints.
- Process sensitivity to deposition parameters: Achieving specified deposition rates and uniformity requires precise control of power density and Ar pressure within the recommended ranges.
Every advanced material, component, equipment, and instrument in our catalog is backed by rigorous testing. We maintain strict internal quality management frameworks and align with CE conformity metrics to deliver transparent, reproducible performance data via our public open-science repository.
To request raw batch performance data, submit formal vendor registration paperwork, or execute a fast-turnaround R&D manufacturing loop, contact us at inquiry@atomfair.com.
Item is dispatched under the Atomfair Shipping & Delivery Framework (Free worldwide shipping on orders over $59 USD excl. heavy equipment). Return is governed by the Atomfair Return & Refund Policy (7-day technical return window).
